Cure Properties of Naphthalene-Based Epoxy Resin Systems with Hardeners and Latent Catalysts for Semiconductor Packaging Materials

2013 ◽  
Vol 579 (1) ◽  
pp. 39-49 ◽  
Author(s):  
Whan Gun Kim ◽  
Hyunaee Chun
Keyword(s):  
Epoxy Resin ◽  
Packaging Materials ◽  
Semiconductor Packaging

scholarly journals Preparation and Thermal Conductivity of Epoxy Resin/Graphene-Fe3O4 Composites

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2013
Author(s):  
Zhong Wu ◽  
Jingyun Chen ◽  
Qifeng Li ◽  
Da-Hai Xia ◽  
Yida Deng ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Epoxy Resin ◽  
Thermomechanical Properties ◽  
Packaging Materials ◽  
Mass Ratio ◽  
Degree Of Orientation ◽  
Ep Matrix ◽  
Electrical Insulation Properties

By modifying the bonding of graphene (GR) and Fe3O4, a stable structure of GR-Fe3O4, namely magnetic GR, was obtained. Under the induction of a magnetic field, it can be orientated in an epoxy resin (EP) matrix, thus preparing EP/GR-Fe3O4 composites. The effects of the content of GR and the degree of orientation on the thermal conductivity of the composites were investigated, and the most suitable Fe3O4 load on GR was obtained. When the mass ratio of GR and Fe3O4 was 2:1, the thermal conductivity could be increased by 54.8% compared with that of pure EP. Meanwhile, EP/GR-Fe3O4 composites had a better thermal stability, dynamic thermomechanical properties, and excellent electrical insulation properties, which can meet the requirements of electronic packaging materials.

Research on Performance of Epoxy Electronic Packaging Materials

2013 ◽  
Vol 668 ◽  
pp. 226-230
Author(s):  
Hao Ran Zhou ◽  
An Sun ◽  
Hao Cheng Yang ◽  
Shuang Zhao
Keyword(s):  
Epoxy Resin ◽  
Electronic Packaging ◽  
Volume Resistivity ◽  
Mechanical Analysis ◽  
Electrical Performance ◽  
Process Conditions ◽  
Packaging Materials ◽  
Curing Process ◽  
Matrix Resin ◽  
Ft Ir

This article the epoxy resin electronic packaging materials was prepared via epoxy resin E-51 as matrix resin, MNA for curing agent, the CTBN as toughening agents, BPO, DMP-30, Al(MM)3, 2E4MZ as curing promoting agents by mechanical blending. The cured condition was 80°C curing 2 h, 90°C curing 2 h, 100°C curing 5 h. The structure of the epoxy resin electronic packaging materials was characterized via FT-IR, the result showed that epoxy resin cured completely. Dynamic mechanical analysis (DMA) is evaluated material thermal stability. The results show that anhydride dosage 7.7 g. The dielectric loss and volume resistivity of epoxy electronic potting were measured via the electrical performance analysis. The results show that epoxy electronic potting having BPO (0.2 g) and DMP-30 (0.1 g) had electrical optimal performance. In the curing process conditions, its performance is meet potting requirements, curing process is feasible.

Improvement of electrical and material properties of epoxy resin/ aluminum nitride nanocomposites for packaging materials

2020 ◽  
Vol 86 ◽  
pp. 106502 ◽  
Author(s):  
Chao Dai ◽  
Xiangrong Chen ◽  
Tie Jiang ◽  
Ashish Paramane ◽  
Yasuhiro Tanaka
Keyword(s):  
Aluminum Nitride ◽  
Epoxy Resin ◽  
Material Properties ◽  
Packaging Materials
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