ChemInform Abstract: FORMATION OF SILICON NITRIDE AT A SILICON-SILICON DIOXIDE INTERFACE DURING LOCAL OXIDATION OF SILICON AND DURING HEAT-TREATMENT OF OXIDIZED SILICON IN AMMONIA GAS

1976 ◽  
Vol 7 (43) ◽  
pp. no-no
Author(s):  
E. KOOI ◽  
J. G. VAN LIEROP ◽  
J. A. APPELS
1993 ◽  
Vol 334 ◽  
Author(s):  
R.T. Kuehn ◽  
X. Xu ◽  
D.J. Holcombe ◽  
V. Misra ◽  
J.J. Wortman ◽  
...  

AbstractAs the feature size of MOSFET devices shrink, issues such as thermal budget associated with controlling channel doping profiles and oxide growth kinetics raise concerns about using thermally grown furnace oxides for deep-submicron device applications. To address these concerns, we have developed a new RTCVD oxide process using a gas system of silane and nitrous oxide. The RTCVD oxides are deposited in a lamp-heated, cold wall, RTP system. Deposition rates ranging from 55 Å/min. to 624 Å/min. can be achieved at 800°C with silane nitrous oxide flow rate ratio of 2% and total pressure ranging from 3 to 10 Torr. The results indicate that this RTCVD process can be used to deposit both thin gate and thick isolation insulators for single wafer processing. Deposition rates of the RTCVD oxides exhibit a nonlinear dependence on the total deposition pressure. Electrical characterization of the as-deposited RTCVD oxides shows a mid-gap interface trap density of < 5×1010 eV−1 cm−2 and an average breakdown field of 13MV/cm. AES, RBS and TEM analyses have been used to study surface cleaning effects on the silicon-silicon dioxide interface quality and to determine the chemical composition of the RTCVD oxides. The results show that RTCVD oxides with stoichiometric composition and atomic flat silicon-silicon dioxide interface can be achieved using silane nitrous oxide flow rate ratio of <2%. I-V characteristics and transconductance degradation under hot carrier stress for MOSFET's using as-deposited RTCVD gate oxides have been found to be comparable to those of MOSFET's using thermal gate oxides.


1987 ◽  
Vol 101 ◽  
Author(s):  
Geoffrey Auvert ◽  
Yves Pauleau ◽  
Didier Tonneau

ABSTRACTThe localized laser-induced deposition of an insulator for silicon-based microelectronics seems to be an unsolved problem. In order to understand the limiting mechanism in the deposition, the formation kinetics of silicon, silicon oxide and silicon nitride using various laser wavelengths and gas mixtures have been studied Depending upon wavelength and laser-induced temperature, various chemical reactions are involved. In the presence of ammonia, the growth rate of silicon nitride dots was found to be lower than the corresponding silicon deposition rate, indicating that deposition starts with silane decomposition followed by nitridation of silicon. By evaluating the influence of the wavelengths, the existence of a photolytic aided reaction is detected in the presence of 2.4 eV photons. In the presence of oxygen molecules and under most experimental conditions, no deposition occurs. The formation of volatile intermediate compounds can explain the difficulty of locally depositing silicon dioxide.


Sign in / Sign up

Export Citation Format

Share Document