Nickel Amperometric Detector Prepared by Electroless Deposition for Microchip Electrophoretic Measurement of Alcohols and Sugars

2004 ◽  
Vol 16 (19) ◽  
pp. 1603-1608 ◽  
Author(s):  
Joseph Wang ◽  
Gang Chen ◽  
Madhu Prakash Chatrathi
Keyword(s):  
Electroless Deposition ◽  
Amperometric Detector ◽  
Electrophoretic Measurement

A three-dimensionally adjustable amperometric detector for microchip electrophoretic measurement of nitroaromatic pollutants

Talanta ◽  
2006 ◽  
Vol 69 (5) ◽  
pp. 1285-1291 ◽  
Author(s):  
Xiao Yao ◽  
Joseph Wang ◽  
Luyan Zhang ◽  
Pengyuan Yang ◽  
Gang Chen
Keyword(s):  
Amperometric Detector ◽  
Electrophoretic Measurement

Microstructural changes of Aluminum Nitride after laser irradiation and electroless copper deposition

1994 ◽  
Vol 52 ◽  
pp. 636-637
Author(s):  
S. Cao ◽  
A. J. Pedraza ◽  
L. F. Allard
Keyword(s):  
Aluminum Nitride ◽  
Laser Irradiation ◽  
Electroless Deposition ◽  
Thermal Evaporation ◽  
Surface Region ◽  
Near Surface ◽  
Laser Patterning ◽  
Electroless Copper ◽  
Excimer Laser Irradiation ◽  
Laser Effect

Excimer-laser irradiation strongly modifies the near-surface region of aluminum nitride (AIN) substrates. The surface acquires a distinctive metallic appearance and the electrical resistivity of the near-surface region drastically decreases after laser irradiation. These results indicate that Al forms at the surface as a result of the decomposition of the Al (which has been confirmed by XPS). A computer model that incorporates two opposing phenomena, decomposition of the AIN that leaves a metallic Al film on the surface, and thermal evaporation of the Al, demonstrated that saturation of film thickness and, hence, of electrical resistance is reached when the rate of Al evaporation equals the rate of AIN decomposition. In an electroless copper bath, Cu is only deposited in laser-irradiated areas. This laser effect has been designated laser activation for electroless deposition. Laser activation eliminates the need of seeding for nucleating the initial layer of electroless Cu. Thus, AIN metallization can be achieved by laser patterning followed by electroless deposition.

Comparison of corrosion resistance properties of Ni-P and Ni-W-P coatings obtained by electroless deposition

2020 ◽  
Vol 25 (2) ◽  
pp. 66-71
Author(s):  
A.B. Drovosekov
Keyword(s):  
Corrosion Resistance ◽  
Sulfuric Acid ◽  
Electroless Deposition ◽  
Corrosion Damage ◽  
Electrochemical Activity ◽  
High Porosity ◽  
Environment Analysis ◽  
Damage Degree ◽  
Lower Porosity ◽  
Electroless Coatings

Corrosion resistance properties, such as porosity, stability in the atmosphere of NaCl mist, and anodic electrochemical activity in a sulfuric acid solution are studied and compared for Ni-W-P and Ni-P coatings obtained by electroless deposition. The studied coatings were obtained from solutions with glycine as the main ligand and contained 10.2 to 15.6 at.% of phosphorus and up to 3.3 at.% of tungsten. It is shown that Ni-W-P coatings with a tungsten content of 2.3 to 3.3 at.% and a thickness of 15 μm have a significantly lower porosity as compared with nickel-phosphorus coatings of the same thickness. Also, significantly better stability of Ni-W-P coatings in a NaCl mist atmosphere was observed, their corrosion damage degree is less than that of Ni-P coatings, and relatively little depends on the duration of exposure in a corrosive environment. Analysis of anodic polarization curves showed an almost similar electrochemical activity upon dissolution of Ni-P and Ni-W-P coatings in sulfuric acid. Both these types of electroless coatings showed a markedly better tendency to anodic dissolution than pure nickel. Taking into account the obtained experimental data, a conclusion is made as to the better protective characteristics of Ni-W-P coatings in comparison with nickel-phosphorus coatings. The main reason of the inferior protective properties of Ni-P coatings is their relatively high porosity.

scholarly journals Enhanced Conductivity and Antibacterial Behavior of Cotton via the Electroless Deposition of Silver

Molecules ◽  
2021 ◽  
Vol 26 (16) ◽  
pp. 4731
Author(s):  
Changkun Liu ◽  
Dan Liao ◽  
Fuqing Ma ◽  
Zenan Huang ◽  
Ji’an Liu ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Deposition Time ◽  
Antibacterial Properties ◽  
Chemical Properties ◽  
Physical And Chemical Properties ◽  
High Antibacterial Activity ◽  
Physical And Chemical ◽  
And Staphylococcus Aureus ◽  
Enhanced Conductivity ◽  
And Chemical Properties

In this study, the surface-initiated atom transfer radical polymerization (SI-ATRP) technique and electroless deposition of silver (Ag) were used to prepare a novel multi-functional cotton (Cotton-Ag), possessing both conductive and antibacterial behaviors. It was found that the optimal electroless deposition time was 20 min for a weight gain of 40.4%. The physical and chemical properties of Cotton-Ag were investigated. It was found that Cotton-Ag was conductive and showed much lower electrical resistance, compared to the pristine cotton. The antibacterial properties of Cotton-Ag were also explored, and high antibacterial activity against both Escherichia coli and Staphylococcus aureus was observed.

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