Characterization of aluminum alloys using a 3D full field measurement

Application of Imaging Techniques to Mechanics of Materials and Structures, Volume 4 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4419-9796-8_4 ◽

2012 ◽

pp. 17-23 ◽

Cited By ~ 1

Author(s):

Marco Rossi ◽

Gianluca Chiappini ◽

Marco Sasso

Keyword(s):

Aluminum Alloys ◽

Field Measurement ◽

Full Field ◽

Full Field Measurement

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Experimental characterization of rupture in human aortic aneurysms using a full-field measurement technique

Biomechanics and Modeling in Mechanobiology ◽

10.1007/s10237-011-0356-5 ◽

2011 ◽

Vol 11 (6) ◽

pp. 841-853 ◽

Cited By ~ 47

Author(s):

Jin-Hwan Kim ◽

Stéphane Avril ◽

Ambroise Duprey ◽

Jean-Pierre Favre

Keyword(s):

Measurement Technique ◽

Field Measurement ◽

Aortic Aneurysms ◽

Experimental Characterization ◽

Full Field ◽

Full Field Measurement

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Applying Full-Field Measurement Techniques for the Thermomechanical Characterization of Shape Memory Alloys: A Review and Classification

Shape Memory and Superelasticity ◽

10.1007/s40830-021-00355-w ◽

2021 ◽

Author(s):

D. Delpueyo ◽

A. Jury ◽

X. Balandraud ◽

M. Grédiac

Keyword(s):

Shape Memory Alloys ◽

Shape Memory ◽

Field Measurement ◽

Measurement Techniques ◽

Full Field ◽

Full Field Measurement ◽

Thermomechanical Characterization

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LCoS spatial light modulators as active phase elements of full-field measurement systems and sensors

Metrology and Measurement Systems ◽

10.2478/v10178-012-0038-3 ◽

2012 ◽

Vol 19 (3) ◽

Cited By ~ 8

Author(s):

Małgorzata Kujawińska ◽

Rosario Porras-Aguilar ◽

Weronika Zaperty Warsaw

Keyword(s):

Field Measurement ◽

Active Phase ◽

Spatial Light Modulators ◽

Full Field ◽

Measurement Systems ◽

Light Modulators ◽

Full Field Measurement

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SHEAROGRAPHY: A Full-Field Measurement Technique and Application in Non-Destructive Testing

10.4271/2005-01-0485 ◽

2005 ◽

Author(s):

Michael Y. Y. Hung

Keyword(s):

Measurement Technique ◽

Field Measurement ◽

Non Destructive Testing ◽

Destructive Testing ◽

Full Field ◽

Full Field Measurement ◽

Non Destructive

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Full-Field Measurement of Deformation of Recycled Paper Using Electronic Speckle Pattern Interferometry

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.270-273.686 ◽

2004 ◽

Vol 270-273 ◽

pp. 686-689 ◽

Cited By ~ 1

Author(s):

Eisaku Umezaki ◽

Jyunnosuke Takakuwa

Keyword(s):

Field Measurement ◽

Speckle Pattern ◽

Electronic Speckle Pattern Interferometry ◽

Recycled Paper ◽

Full Field ◽

Full Field Measurement

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Importance of Full-Field Measurement Techniques for Better Models in Solid Mechanics

Experimental Analysis of Nano and Engineering Materials and Structures ◽

10.1007/978-1-4020-6239-1_6 ◽

2007 ◽

pp. 13-14

Author(s):

Michel Grediac

Keyword(s):

Field Measurement ◽

Solid Mechanics ◽

Measurement Techniques ◽

Full Field ◽

Full Field Measurement

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Research on full-field measurement of optical film thickness by processing double interferometric fringes based on digital wavefront interferometry

10.1117/12.839934 ◽

2009 ◽

Author(s):

Long-jiang Chen ◽

Yi-yong Liang ◽

Jian-bo Luo ◽

Chun-hui Zhang ◽

Guo-guang Yang

Keyword(s):

Film Thickness ◽

Field Measurement ◽

Full Field ◽

Optical Film ◽

Full Field Measurement

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Full-field measurement with nanometric accuracy of 3D superficial displacements by digital profile correlation: A powerful tool for mechanics of materials

Materials & Design ◽

10.1016/j.matdes.2018.08.052 ◽

2018 ◽

Vol 159 ◽

pp. 170-185 ◽

Cited By ~ 2

Author(s):

Luigi Bruno

Keyword(s):

Field Measurement ◽

Full Field ◽

Mechanics Of Materials ◽

Full Field Measurement

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Full-field measurement of micro strain of printed circuit board assembly using digital image correlation

Infrared and Laser Engineering ◽

10.3788/irla201746.1103004 ◽

2017 ◽

Vol 46 (11) ◽

pp. 1103004

Author(s):

杨靖 Yang Jing ◽

吴思进 Wu Sijin ◽

郑伟巍 Zheng Weiwei ◽

李伟仙 Li Weixian ◽

杨连祥 Yang Lianxiang

Keyword(s):

Digital Image Correlation ◽

Field Measurement ◽

Printed Circuit Board ◽

Image Correlation ◽

Circuit Board ◽

Printed Circuit Board Assembly ◽

Full Field ◽

Printed Circuit ◽

Full Field Measurement ◽

Circuit Board Assembly

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Full-Field Measurement of Residual Stresses in Composite Materials Using the Incremental Slitting and Digital Image Correlation Techniques

Experimental Mechanics ◽

10.1007/s11340-020-00640-2 ◽

2020 ◽

Vol 60 (9) ◽

pp. 1239-1250

Author(s):

S. D. Salehi ◽

M. A. Rastak ◽

M. M. Shokrieh ◽

L. Barrallier ◽

R. Kubler

Keyword(s):

Composite Materials ◽

Digital Image Correlation ◽

Residual Stresses ◽

Digital Image ◽

Field Measurement ◽

Image Correlation ◽

Full Field ◽

Full Field Measurement ◽

Correlation Techniques

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