Integrated Computational Mechanics and Optimization for Design of Electronic Components

2002 ◽  
pp. 57-70 ◽  
Author(s):  
S. Stoyanov ◽  
C. Bailey ◽  
H. Lu ◽  
M. Cross
2011 ◽  
Vol 39 (4) ◽  
pp. 223-244 ◽  
Author(s):  
Y. Nakajima

Abstract The tire technology related with the computational mechanics is reviewed from the standpoint of yesterday, today, and tomorrow. Yesterday: A finite element method was developed in the 1950s as a tool of computational mechanics. In the tire manufacturers, finite element analysis (FEA) was started applying to a tire analysis in the beginning of 1970s and this was much earlier than the vehicle industry, electric industry, and others. The main reason was that construction and configurations of a tire were so complicated that analytical approach could not solve many problems related with tire mechanics. Since commercial software was not so popular in 1970s, in-house axisymmetric codes were developed for three kinds of application such as stress/strain, heat conduction, and modal analysis. Since FEA could make the stress/strain visible in a tire, the application area was mainly tire durability. Today: combining FEA with optimization techniques, the tire design procedure is drastically changed in side wall shape, tire crown shape, pitch variation, tire pattern, etc. So the computational mechanics becomes an indispensable tool for tire industry. Furthermore, an insight to improve tire performance is obtained from the optimized solution and the new technologies were created from the insight. Then, FEA is applied to various areas such as hydroplaning and snow traction based on the formulation of fluid–tire interaction. Since the computational mechanics enables us to see what we could not see, new tire patterns were developed by seeing the streamline in tire contact area and shear stress in snow in traction.Tomorrow: The computational mechanics will be applied in multidisciplinary areas and nano-scale areas to create new technologies. The environmental subjects will be more important such as rolling resistance, noise and wear.


Author(s):  
Toni Vesansalo ◽  
Henrikki Pantsar ◽  
Jukka Martikainen

Author(s):  
Luís Henrique Carnevale da Cunha ◽  
Gustavo Rabello dos Anjos ◽  
Norberto Mangiavacchi

Alloy Digest ◽  
1975 ◽  
Vol 24 (9) ◽  

Abstract BERYLCO NICKEL ALLOY 440 is an age-hardenable nickel-beryllium-titanium alloy that offers high strength, excellent spring properties outstanding formability, good high-temperature mechanical properties, and resistance to corrosion and fatigue. Complex shapes can be produced in the solution-treated (soft) condition and then aged to a minimum tensile strength of 215,500 psi. It is used for mechanical and electrical/electronic components in the temperature range -320 to 800 F. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fracture toughness. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Ni-94. Producer or source: Kawecki Berylco Industries Inc.. Originally published September 1964, revised September 1975.


Alloy Digest ◽  
2006 ◽  
Vol 55 (4) ◽  

Abstract HPM 233 is a wrought nickel with low carbon. The alloy is used in electrical and electronic components. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Ni-635. Producer or source: Hamilton Precision Metals.


Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.


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