Modern Approaches to Fatigue Life Prediction of SMT Solder Joints

A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical loading, is quantified thermodynamic framework. The damage, as an internal state variable, is coupled with unified viscoplastic constitutive model to characterize the response of solder alloys. The damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in ABAQUS finite element package to simulate the cyclic softening behavior of solder joints. Several computational simulations of uniaxial monotonic tensile and cyclic shear tests are conducted to validate the model with experimental results. The behavior of an actual ball grid array (BGA) package under thermal fatigue loading is also simulated and compared with experimental results.

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Thermal cycle fatigue life prediction for flip chip solder joints

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897361 ◽

2014 ◽

Cited By ~ 4

Author(s):

Robert Darveaux

Keyword(s):

Fatigue Life ◽

Thermal Cycle ◽

Life Prediction ◽

Flip Chip ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Cycle Fatigue

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Thermal fatigue life prediction for solder joints with the consideration of damage evolution

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.756016 ◽

2002 ◽

Author(s):

X. Zhang ◽

S.-W.R. Lee

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Damage Evolution ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Journal of Electronic Packaging ◽

10.1115/1.4043405 ◽

2019 ◽

Vol 141 (4) ◽

Cited By ~ 13

Author(s):

Sinan Su ◽

Francy John Akkara ◽

Ravinder Thaper ◽

Atif Alkhazali ◽

Mohammad Hamasha ◽

...

Keyword(s):

Fatigue Life ◽

Life Prediction ◽

Prediction Models ◽

Solder Joints ◽

State Of The Art ◽

Electronic Devices ◽

Creep Damage ◽

Fatigue Life Prediction ◽

Factors Affecting ◽

Causes Of Failure

Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications and potential limitations for those models are also discussed.

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