Modeling Process-Dependent Thermal Silicon Dioxide (SiO2) Films on Silicon

Author(s):  
H. F. Wei ◽  
A. K. Henning ◽  
J. Slinkman ◽  
J. L. Rogers
2000 ◽  
Vol 611 ◽  
Author(s):  
Akira Izumi ◽  
Hidekazu Sato ◽  
Hideki Matsumura

ABSTRACTThis paper reports a procedure for low-temperature nitridation of silicon dioxide (SiO2) surfaces using species produced by catalytic decomposition of NH3 on heated tungsten in catalytic chemical vapor deposition (Cat-CVD) system. The surface of SiO2/Si(100) was nitrided at temperatures as low as 200°C. X-ray photoelectron spectroscopy measurements revealed that incorporated N atoms are bound to Si atoms and O atoms and located top-surface of SiO2.


1984 ◽  
Vol 86 (1) ◽  
pp. 93-100 ◽  
Author(s):  
N. V. Rumak ◽  
V. V. Khatko ◽  
V. N. Plotnikov

2005 ◽  
Vol 108-109 ◽  
pp. 39-44
Author(s):  
Ida E. Tyschenko ◽  
A.B. Talochkin ◽  
E.N. Vandyshev ◽  
A.G. Cherkov ◽  
Andrzej Misiuk

The properties of Si and Ge nanocrystals with uniformly strained Si-Si and Ge-Ge bonds have been studied. The strained Si and Ge nanocrystals were produced by the implantation of Ge+ or Si+ ions in thermally grown SiO2 films subsequently annealed under hydrostatic pressure ranging from 1 bar to 12 kbar. Correlation between the formation of the hydrostatically strained nanocrystals and the features of the photoluminescence spectra has been observed. The obtained results are discussed in terms of broadening energy gap between the levels of electron states of the hydrostatically strained nanocrystals. This effect brings about direct radiative recombination.


2007 ◽  
Vol 353-358 ◽  
pp. 2920-2923
Author(s):  
Ke Jia Li ◽  
Xia Xiao ◽  
Yu Feng Jin

Porous silicon dioxide films featuring low dielectric constant are of great scientific and commercial interest because of their outstanding potential for application to microelectronic interconnect. However, some reliability problems arise in porous SiO2 films due to their poor mechanical performance. Therefore, it is very important to understand the mechanical and electrical properties of porous SiO2 films. New 2-D models with circle pores and 3-D models with cubic pores are proposed in this work. Simulated results of porous SiO2 structures in the case of periodic and random arrangement, which are implemented through ANSYS, are also provided. Critical parameters such as Young’s modulus E and dielectric constant k of porous films are investigated. Calculation results show that dielectric constant reaches as low as 2.5 when porosity of films is about 40%, while E keeps over 3 GPa if porosity remains in the range from 30% to 40%.


2001 ◽  
Vol 670 ◽  
Author(s):  
Akira Izumi ◽  
Hidekazu Sato ◽  
Hideki Matsumura

ABSTRACTThis paper reports structural and electrical properties of catalytic-nitrided silicon dioxide (SiO2) films. The surface of SiO2/Si(100) was nitrided at temperatures below 573 K. It was found that the incorporated N atoms are bound to Si atoms and O atoms and located on the top-surface of SiO2. Catalytic-nitrided SiO2 films have small amounts of Si-OH bonds and adequate resistance to boron (B) penetration.


2011 ◽  
Vol 131 (7) ◽  
pp. 235-239 ◽  
Author(s):  
Kaoru Yamashita ◽  
Tomoya Yoshizaki ◽  
Minoru Noda ◽  
Masanori Okuyama

2003 ◽  
Vol 32 (5) ◽  
pp. 211-218
Author(s):  
Isamu SHINNO ◽  
Jianming XU ◽  
Toshiyuki ISOBE

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