Influence of Firing Temperature and Atmospheric Conditions on Processing of Direct Bond Copper (DBC)

2017 ◽  
pp. 133-139
Author(s):  
Jinlong Xu ◽  
Joyce Zhang ◽  
Ken Kuang
Keyword(s):  
Firing Temperature ◽  
Atmospheric Conditions ◽  
Direct Bond ◽  
Direct Bond Copper

Direct-Bond-Copper Switch Module for Management of Temperature and Noise in 220-W/in3 Power Assembly

2014 ◽  
Vol 11 (4) ◽  
pp. 174-180 ◽  
Author(s):  
Woochan Kim ◽  
Jongwon Shin ◽  
Khai D. T. Ngo
Keyword(s):  
Power Density ◽  
Temperature Rise ◽  
Junction Temperature ◽  
High Power Density ◽  
Switching Noise ◽  
Direct Bond ◽  
The Right ◽  
Negative Coupling ◽  
Switch Module ◽  
Direct Bond Copper

Achieving high-power density is a challenge in the presence of stringent specifications on temperature rise and switching noise. Integration of the direct-bond-copper module with PCB mother board was found to be the right approach to achieve 220-W/in3 power density, 2-kW output power, and 48.9°C junction-temperature rise. The reduced layout inductance (2.89 nH) at the source and the negative coupling between source and drain layout inductances suppressed turn-off noise. The prototyped dc-dc boost converter switched between 400 kHz to 1 MHz without self-turn-on problems.

Direct Bond Copper (DBC) Technologies

2017 ◽  
pp. 123-132
Author(s):  
Ron Visser ◽  
John B. Snook
Keyword(s):  
Direct Bond ◽  
Direct Bond Copper

scholarly journals Fabrication of Ceramic Interposers for Module Packaging

2020 ◽  
Vol 17 (2) ◽  
pp. 67-72
Author(s):  
Rana Alizadeh ◽  
Kaoru Uema Porter ◽  
Tom Cannon ◽  
Simon S. Ang
Keyword(s):  
Low Temperature ◽  
Fabrication Process ◽  
Electrical Insulation ◽  
Mechanical Support ◽  
Power Electronic ◽  
Power Semiconductor ◽  
Direct Bond ◽  
3D Printed ◽  
Direct Bond Copper

Abstract In this study, low-temperature cofired ceramic (LTCC) and 3D-printed ceramic interposers are designed and fabricated for a double-sided power electronic module. The interposer acts as electrical insulation between two direct-bond copper (DBC) power substrates as well as mechanical support to evenly distribute the weight of the top DBC substrate onto the entire bottom DBC substrate instead of directly onto the bare power semiconductor die. A novel LTCC fabrication process for 14 layers of green tapes with premachined recesses and holes is developed. A similar interposer is 3D printed using a ceramic resin. Finally, the fabricated LTCC and 3D-printed interposers are compared.

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