Exact and Approximate Linear and Nonlinear Initial Failure Analysis of Laminated Mindlin Plates in Flexure

1989 ◽  
pp. 133-171 ◽  
Author(s):  
G. J. Turvey ◽  
M. Y. Osman
Keyword(s):  
Failure Analysis ◽  
Initial Failure ◽  
Linear And Nonlinear

Flexural failure analysis of angle-ply laminates of gfrp and cfrp

1980 ◽  
Vol 15 (1) ◽  
pp. 43-49 ◽  
Author(s):  
G J Turvey
Keyword(s):  
Exact Solution ◽  
Failure Analysis ◽  
Failure Criterion ◽  
Equilibrium Equations ◽  
Initial Failure ◽  
Flexural Failure ◽  
Failure Data ◽  
Centre Line ◽  
Failure Loads ◽  
Is Failure

An exact solution of the strip equilibrium equations is combined with the Tsai-Hill failure criterion to facilitate an initial flexural failure analysis of uniformly-loaded, antisymmetrically-laminated, GFRP and CFRP angle-ply strips. Dimensionless, initial-failure data (that is, failure loads and their associated strip centre-line deflections) are presented for the practical range of fibre orientations, 15° ≤|θ| ≤ 75°, in strips comprising up to ten laminae.

Failure Analysis of ILD Delamination—Uncovering Multiple Root Causes

2015 ◽  
Author(s):  
Marie Castignolles ◽  
Thomas Zirilli ◽  
Eric Cattey ◽  
Justin Lewenstein ◽  
Steve Schauer ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Optical Microscopy ◽  
Cross Sections ◽  
Multiple Root ◽  
Wafer Fabrication ◽  
Multiple Factors ◽  
Initial Failure ◽  
Underlying Causes ◽  
Complete Set

Abstract FA cannot consist of simply jumping to conclusions. The FA process is validated through correlation with the initial failure and through interpretation of the obtained results, subjective by definition. This paper illustrates the difficulty of analyzing complex failures caused by multiple factors, including wafer fabrication, assembly, and application conditions. Inter-Layer Dielectric (ILD) delamination was experienced on various ICs from the same 250nm technology. A complete set of techniques (C-SAM, laser and optical microscopy, SEM, FIB cross-sections, TEM, EFTEM, SIMS, Auger, delineation) was used as different pieces of the same puzzle to reveal the multiple factors contributing to the ILD delamination failures. Due to the subtle nature of some of the underlying causes, defining an accurate FA approach with appropriate sample preparation and accurate device traceability was critical to understanding this complex, multivariate issue.

Large deflection initial failure analysis of angle-ply laminated plates

1993 ◽  
Vol 25 (1-4) ◽  
pp. 529-539
Author(s):  
G.J. Turvey ◽  
M.Y. Osman
Keyword(s):  
Failure Analysis ◽  
Large Deflection ◽  
Laminated Plates ◽  
Initial Failure

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

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