Experimental Investigation on the Thermal Performance of the Light-Emitting Diode (LED) Heat Sinks

2018 ◽  
pp. 357-362
Author(s):  
A. S. Praveen ◽  
Kaipa Sai Chaithanya ◽  
R. Jithin ◽  
K. Naveen Kumar
Keyword(s):  
Experimental Investigation ◽  
Thermal Performance ◽  
Light Emitting Diode ◽  
Heat Sinks ◽  
Light Emitting

Experimental investigation on the thermal performance of a light emitting diode headlamp with a flexible woven heat sink

2017 ◽  
Vol 127 ◽  
pp. 1215-1222 ◽  
Author(s):  
Songmao Chen ◽  
Kaihang Chen ◽  
Zongtao Li ◽  
Yong Tang ◽  
Baoshan Zhuang ◽  
...  
Keyword(s):  
Experimental Investigation ◽  
Thermal Performance ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Light Emitting

scholarly journals Thermal performance of heat sink with fluid pockets for high power light emitting diode

2017 ◽  
Vol 14 (4) ◽  
pp. 4846-4862
Author(s):  
Sangmesh ◽  
◽  
Gopalakrishna Keshava Narayana ◽  
Manjunath Shiraganhalli Honnaiah ◽  
Krishna Venkatesh ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Light Emitting

Low Cost Cooling Device for High Power LED Lamps

2020 ◽  
Author(s):  
Pamela Martinez-Vega ◽  
Araceli Lopez-Badillo ◽  
J. Luis Luviano-Ortiz ◽  
Abel Hernandez-Guerrero ◽  
Jaime G. Cervantes
Keyword(s):  
Reference Model ◽  
Light Emitting Diode ◽  
Low Cost ◽  
Cost Effective ◽  
Heat Sinks ◽  
Modern World ◽  
Type Model ◽  
Light Emitting

Abstract The modern world progressively demands more energy; according to forecasts energy consumption will grow at an average annual rate of 3 percent. Therefore, it is necessary to purchase products or devices that are efficient and environmentally friendly. Technology in LED (Light Emitting Diode) lighting is presented as an alternative to energy saving, since LEDs have proven to be extremely efficient, have a long service life and their cost-effective ratio is very good. However, the heat emitted by the LED chip must be dissipated effectively, since the overheating of the chip reduces the efficiency and lifetime of the lamp. Therefore, heat sinks that are reliable, efficient and inexpensive should be designed and built. The present work proposes new designs for heat sinks in LED lamps, some of the models in the design of the fins refer to the Fibonacci series. The models proposed in the present work that have a significant advantage are the Type 1E Model (5.2% mass savings and better thermal efficiency of 8.33%), GR Type 1 Model (3.12% lighter and 3.33% more efficient) and the GRL Type Model (4. 51% mass savings and 5.55% thermally more efficient) compared to the Type 2 Reference Model proposed by Jang et al. [12].

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

2017 ◽  
Vol 139 (2) ◽  
Author(s):  
Umut Zeynep Uras ◽  
Mehmet Arık ◽  
Enes Tamdoğan
Keyword(s):  
Thermal Performance ◽  
Computational Models ◽  
Printed Circuit Boards ◽  
Light Emitting Diode ◽  
Ambient Conditions ◽  
Vapor Chamber ◽  
Metal Core ◽  
Light Emitting ◽  
Lighting Systems ◽  
Light Engine

In recent years, light emitting diodes (LEDs) have become an attractive technology for general and automotive illumination systems replacing old-fashioned incandescent and halogen systems. LEDs are preferable for automobile lighting applications due to its numerous advantages such as low power consumption and precise optical control. Although these solid state lighting (SSL) products offer unique advantages, thermal management is one of the main issues due to severe ambient conditions and compact volume. Conventionally, tightly packaged double-sided FR4-based printed circuit boards (PCBs) are utilized for both driver electronic components and LEDs. In fact, this approach will be a leading trend for advanced internet of things applications embedded LED systems in the near future. Therefore, automotive lighting systems are already facing with tight-packaging issues. To evaluate thermal issues, a hybrid study of experimental and computational models is developed to determine the local temperature distribution on both sides of a three-purpose automotive light engine for three different PCB approaches having different materials but the same geometry. Both results showed that FR4 PCB has a temperature gradient (TMaxBoard to TAmbient) of over 63 °C. Moreover, a number of local hotspots occurred over FR4 PCB due to low thermal conductivity. Later, a metal core PCB is investigated to abate local hot spots. A further study has been performed with an advanced heat spreader board based on vapor chamber technology. Results showed that a thermal enhancement of 7.4% and 25.8% over Al metal core and FR4-based boards with the advanced vapor chamber substrate is observed. In addition to superior thermal performance, a significant amount of lumen extraction in excess of 15% is measured, and a higher reliability rate is expected.

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Kyoung Joon Kim
Keyword(s):  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Internal Flow ◽  
Thermal Control ◽  
Numerical Prediction ◽  
Light Emitting ◽  
Convection Condition ◽  
Pin Fins

In this paper we introduce a hybrid fin heat sink (HFH) proposed for the thermal control of light emitting diode (LED) lighting modules. The HFH consists of the array of hybrid fins which are hollow pin fins having internal channels and integrated with plate fins. The thermal performance of the HFH under either natural or forced convection condition is both experimentally and numerically investigated, and then its performance is compared with that of a pin fin heat sink (PFH). The observed maximum discrepancies of the numerical prediction to the measurement for the HFH are 7% and 6% for natural and forced convection conditions. The reasonable discrepancies demonstrate the tight correlation between the numerical prediction and the measurement. The thermal performance of the HFH is found to be 12–14% better than the PFH for the natural convection condition. The better performance might be explained by the enlarged external surface and the internal flow via the channel of the HF. The reference HFH is about 14% lighter than the reference PFH. The better thermal performance and the lighter weight of the HFH show the feasibility as the promising heat sink especially for the thermal control of LED street and flood lighting modules.

scholarly journals Robust thermal performance of Sr2Si5N8:Eu2+: An efficient red emitting phosphor for light emitting diode based white lighting

2011 ◽  
Vol 99 (24) ◽  
pp. 241106 ◽  
Author(s):  
Stuart E. Brinkley ◽  
Nathan Pfaff ◽  
Kristin A. Denault ◽  
Zhijun Zhang ◽  
H. T. (Bert) Hintzen ◽  
...  
Keyword(s):  
Thermal Performance ◽  
Light Emitting Diode ◽  
Light Emitting ◽  
Red Emitting Phosphor

Thermal Performance Evaluation and Economic Analysis of LED Integrated with Thermoelectric Cooler Package

2011 ◽  
Vol 216 ◽  
pp. 106-110 ◽  
Author(s):  
Hong Qin ◽  
Da Liang Zhong ◽  
Chang Hong Wang
Keyword(s):  
Economic Analysis ◽  
Thermal Performance ◽  
Power Dissipation ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Vital Role ◽  
Junction Temperature ◽  
Total Power ◽  
Thermoelectric Cooler ◽  
Light Emitting

Thermal management is an important issue for light emitting diodes’ utilization. For high power light emitting diode (LED), active heat dissipation method plays a vital role. As a new cooling device, thermoelectric cooler (TEC) is applied in LED packaging for the precisely temperature controlled advantage. In order to evaluate the thermal performance of the TEC packaging designs in LED, experimental measurement is used to assess the chip’s junction temperature of three different cooling models, which include the heatsink model, the heatsink and fan model and the TEC, heatsink and fan model. Based on the research, it is better to apply TEC cooling methods with the power dissipation of LED less than 35 W and the wind speed is 3.6 m/s. However, the power dissipation of TEC itself plays a vital role of the total power dissipation of LED packaging. The results of economic analysis shows that the LED integrated with TEC package achieves 22.34% and 44.73% electric energy saving under the condition of 20 W and 30 W power dissipation of the LED chip contrasts to the fluorescent lamp, but sacrifices 2.71% electric power under the condition of 10 W power dissipation of the LED chip.

Temperature Regulation for LED Lamps Using Fans

2013 ◽  
Vol 753-755 ◽  
pp. 1931-1938
Author(s):  
Hyeung Sik Choi ◽  
Hee Young Shin ◽  
Ji Youn Oh ◽  
Tae Woo Lim ◽  
Yun Hae Kim
Keyword(s):  
Temperature Control ◽  
Temperature Regulation ◽  
Light Emitting Diode ◽  
Operation Time ◽  
Heat Sinks ◽  
Optimal Size ◽  
Light Emitting ◽  
Regulation Scheme ◽  
Cooling Fan ◽  
Relationship Of

A temperature regulation control for LED(Light Emitting Diode) lamp using a cooling fan was studied. An efficient temperature regulation scheme using fan wind at the lowest sound noise was studied. For the study, after measurement of the minimum sound noise of the fan and related temperature of the LED lamp through tests, experiments on temperature control of the LED lamp using the fan with various size of heat sinks was performed. Also, characteristics and relationship of heat sinks and fans are studied through experiments. To reduce the fan sound noise, a method of reducing the operation time with optimal size of the heat sink was studied.

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