Evidence for muonium emission from an SiO2 layer on n-type Si and the positive muon state in Si

1991 ◽  
Vol 65 (1-4) ◽  
pp. 1071-1080 ◽  
Author(s):  
A. Matsushita ◽  
Y. Miyake ◽  
Y. Murata ◽  
K. Nishiyama ◽  
K. Nagamine ◽  
...  
Keyword(s):  

Author(s):  
N. Rozhanski ◽  
A. Barg

Amorphous Ni-Nb alloys are of potential interest as diffusion barriers for high temperature metallization for VLSI. In the present work amorphous Ni-Nb films were sputter deposited on Si(100) and their interaction with a substrate was studied in the temperature range (200-700)°C. The crystallization of films was observed on the plan-view specimens heated in-situ in Philips-400ST microscope. Cross-sectional objects were prepared to study the structure of interfaces.The crystallization temperature of Ni5 0 Ni5 0 and Ni8 0 Nb2 0 films was found to be equal to 675°C and 525°C correspondingly. The crystallization of Ni5 0 Ni5 0 films is followed by the formation of Ni6Nb7 and Ni3Nb nucleus. Ni8 0Nb2 0 films crystallise with the formation of Ni and Ni3Nb crystals. No interaction of both films with Si substrate was observed on plan-view specimens up to 700°C, that is due to the barrier action of the native SiO2 layer.





Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 89
Author(s):  
Jongwon Lee ◽  
Kilsun Roh ◽  
Sung-Kyu Lim ◽  
Youngsu Kim

This is the first demonstration of sidewall slope control of InP via holes with an etch depth of more than 10 μm for 3D integration. The process for the InP via holes utilizes a common SiO2 layer as an InP etch mask and conventional inductively coupled plasma (ICP) etcher operated at room temperature and simple gas mixtures of Cl2/Ar for InP dry etch. Sidewall slope of InP via holes is controlled within the range of 80 to 90 degrees by changing the ICP power in the ICP etcher and adopting a dry-etched SiO2 layer with a sidewall slope of 70 degrees. Furthermore, the sidewall slope control of the InP via holes in a wide range of 36 to 69 degrees is possible by changing the RF power in the etcher and introducing a wet-etched SiO2 layer with a small sidewall slope of 2 degrees; this wide slope control is due to the change of InP-to-SiO2 selectivity with RF power.



2006 ◽  
Vol 77 (3) ◽  
pp. 03A510 ◽  
Author(s):  
Hiroshi Tsuji ◽  
Nobutoshi Arai ◽  
Naoyuki Gotoh ◽  
Takashi Minotani ◽  
Toyoji Ishibashi ◽  
...  




1981 ◽  
Vol 8 (4-6) ◽  
pp. 687-700
Author(s):  
K. G. Lynn
Keyword(s):  


1994 ◽  
Vol 86 (1) ◽  
pp. 561-567 ◽  
Author(s):  
T. R. Adams ◽  
R. L. Lichti ◽  
T. L. Gibson


2003 ◽  
Vol 37 (10) ◽  
pp. 1190-1194 ◽  
Author(s):  
V. A. Volodin ◽  
M. D. Efremov ◽  
A. I. Nikiforov ◽  
D. A. Orekhov ◽  
O. P. Pchelyakov ◽  
...  


2021 ◽  
Author(s):  
Jordi Verdu ◽  
Patricia Silveira ◽  
Eloi Guerrero ◽  
Lluis Acosta ◽  
Pedro De Paco


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