Mechanical properties of ultrananocrystalline diamond thin films relevant to MEMS/NEMS devices

2003 ◽  
Vol 43 (3) ◽  
pp. 256-268 ◽  
Author(s):  
H. D. Espinosa ◽  
B. C. Prorok ◽  
B. Peng ◽  
K. H. Kim ◽  
N. Moldovan ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Ultrananocrystalline Diamond ◽  
Diamond Thin Films

scholarly journals Cell Growth on Different Types of Ultrananocrystalline Diamond Thin Films

2012 ◽  
Vol 3 (3) ◽  
pp. 588-600 ◽  
Author(s):  
Bing Shi ◽  
Qiaoling Jin ◽  
Liaohai Chen ◽  
Amina S. Woods ◽  
Albert J. Schultz ◽  
...  
Keyword(s):  
Thin Films ◽  
Cell Growth ◽  
Ultrananocrystalline Diamond ◽  
Different Types ◽  
Diamond Thin Films

Mechanical Properties of Ultrananocrystalline Diamond Thin Films for MEMS Applications

2002 ◽  
Vol 741 ◽  
Author(s):  
H.D. Espinosa ◽  
B. Peng ◽  
K.-H. Kim ◽  
B.C. Prorok ◽  
N. Moldovan ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Moduli ◽  
Microelectromechanical Systems ◽  
Nanosized Particles ◽  
Good Reproducibility ◽  
Fracture Properties ◽  
Ultrananocrystalline Diamond ◽  
Mems Fabrication ◽  
Membrane Deflection

ABSTRACTMicrocantilever deflection and the membrane deflection experiment (MDE) were used to examine the elastic and fracture properties of ultrananocrystalline diamond (UNCD) thin films in relation to their application to microelectromechanical systems (MEMS). Freestanding microcantilevers and membranes were fabricated using standard MEMS fabrication techniques adapted to our UNCD film technology. Elastic moduli measured by both methods described above are in agreement, with the values being in the range 930 and 970 GPa with both techniques showing good reproducibility. The MDE test showed fracture strength to vary from 3.95 to 5.03 GPa when seeding was performed with ultrasonic agitation of nanosized particles.

Materials science and fabrication processes for a new MEMS technology based on ultrananocrystalline diamond thin films

2004 ◽  
Vol 16 (16) ◽  
pp. R539-R552 ◽  
Author(s):  
Orlando Auciello ◽  
James Birrell ◽  
John A Carlisle ◽  
Jennifer E Gerbi ◽  
Xingcheng Xiao ◽  
...  
Keyword(s):  
Thin Films ◽  
Materials Science ◽  
Ultrananocrystalline Diamond ◽  
Mems Technology ◽  
Diamond Thin Films

Fracture strength of ultrananocrystalline diamond thin films—identification of Weibull parameters

2003 ◽  
Vol 94 (9) ◽  
pp. 6076-6084 ◽  
Author(s):  
H. D. Espinosa ◽  
B. Peng ◽  
B. C. Prorok ◽  
N. Moldovan ◽  
O. Auciello ◽  
...  
Keyword(s):  
Thin Films ◽  
Fracture Strength ◽  
Weibull Parameters ◽  
Ultrananocrystalline Diamond ◽  
Diamond Thin Films

Ultrananocrystalline diamond thin films for MEMS and moving mechanical assembly devices

2001 ◽  
Vol 10 (11) ◽  
pp. 1952-1961 ◽  
Author(s):  
A.R. Krauss ◽  
O. Auciello ◽  
D.M. Gruen ◽  
A. Jayatissa ◽  
A. Sumant ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Assembly ◽  
Ultrananocrystalline Diamond ◽  
Diamond Thin Films

Mechanical properties of diamond thin films quantitative measured by means of blister test

2008 ◽  
Vol 24 (3) ◽  
pp. 183-187 ◽  
Author(s):  
D. H. Xiang ◽  
M. Chen ◽  
Y. P. Ma ◽  
F. H. Sun
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Blister Test ◽  
Diamond Thin Films
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