Study on brittle material removal in the grinding process utilizing theoretical analysis and numerical simulation

2016 ◽  
Vol 87 (9-12) ◽  
pp. 2603-2614 ◽  
Author(s):  
Changchu Wang ◽  
Jianbin Chen ◽  
Qihong Fang ◽  
Feng Liu ◽  
Youwen Liu
Keyword(s):  
Numerical Simulation ◽  
Theoretical Analysis ◽  
Brittle Material ◽  
Material Removal ◽  
Grinding Process ◽  
Brittle Material Removal

scholarly journals Simulation of the ductile machining mode of silicon

2021 ◽  
Author(s):  
Hagen Klippel ◽  
Stefan Süssmaier ◽  
Matthias Röthlin ◽  
Mohamadreza Afrasiabi ◽  
Uygar Pala ◽  
...  
Keyword(s):  
Brittle Material ◽  
Material Removal ◽  
Machining Process ◽  
Ductile Material ◽  
Diamond Wire ◽  
Ductile Machining ◽  
Mesh Free ◽  
Diamond Wire Sawing ◽  
Material Removal Mode ◽  
Brittle Material Removal

AbstractDiamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Under certain conditions, the generally brittle material can be machined in ductile mode, whereby considerably fewer cracks occur in the surface than with brittle material removal. In the presented paper, a numerical model is developed in order to support the optimisation of the machining process regarding the transition between ductile and brittle material removal. The simulations are performed with an GPU-accelerated in-house developed code using mesh-free methods which easily handle large deformations while classic methods like FEM would require intensive remeshing. The Johnson-Cook flow stress model is implemented and used to evaluate the applicability of a model for ductile material behaviour in the transition zone between ductile and brittle removal mode. The simulation results are compared with results obtained from single grain scratch experiments using a real, non-idealised grain geometry as present in the diamond wire sawing process.

Study on Removal and Embedding Mechanism of CdZnTe Using Loose Abrasive

2007 ◽  
Vol 24-25 ◽  
pp. 201-210
Author(s):  
Yan Li ◽  
Hang Gao ◽  
Ren Ke Kang
Keyword(s):  
Physical Model ◽  
Brittle Material ◽  
Material Removal ◽  
Substrate Material ◽  
Material Surface ◽  
Removal Mechanism ◽  
Hard And Brittle Material ◽  
Series Of Experiments ◽  
Three Body ◽  
Brittle Material Removal

Cd1−xZnxTe (CZT) is an excellent ternary compound semiconductor. CZT is the most suitable substrate material for Hg1−yCdyTe epitaxial growth and can make the detector itself. The researchers have done a lot of works on the hard and brittle material removal mechanism in lapping process. however, no published articles are available regarding the removal mechanism and the abrasives embedding mechanism of the soft and brittle material in lapping progress .and there is its own characteristic if the hard abrasives machining the soft and brittle material in lapping progress, the objective of this paper is to build the physical model ,and divide the abrasive into four kinds of abrasives , they are two-body abrasive ,three-body abrasive ,embedded abrasive and small abrasive, and the authors analyze the effects on the material surface of the above abrasives. At last, design series of experiments, through analyzing the results and observe the surface morphology, the authors prove that the physical model is correct.

scholarly journals Simulation of the Ductile Machining Mode of Silicon

2021 ◽  
Author(s):  
Hagen Klippel ◽  
Stefan Süssmaier ◽  
Matthias Röthlin ◽  
Mohamadreza Afrasiabi ◽  
Uygar Pala ◽  
...  
Keyword(s):  
Brittle Material ◽  
Material Removal ◽  
Machining Process ◽  
Ductile Machining ◽  
Mesh Free ◽  
Ductile Mode ◽  
Single Grain ◽  
Diamond Wire Sawing ◽  
Material Removal Mode ◽  
Brittle Material Removal

Abstract Diamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, thesurface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Undercertain conditions the generally brittle material can be machined in ductile mode, whereby considerably fewer cracksoccur in the surface than with brittle material removal. In the presented paper a numerical model is developed in orderto support the optimization of the machining process regarding the transition between ductile and brittle materialremoval. The simulations are performed with an GPUaccelerated in–house developed code using mesh-free methodswhich easily handle large deformations while classic methods like FEM would require intensive remeshing. Thesimulation results are compared with results obtained from single grain scratch experiments.

scholarly journals Tentative Investigations on Reducing the Edge Effects in Pre-Polishing the Optics

2020 ◽  
Vol 10 (15) ◽  
pp. 5286
Author(s):  
Xiaolong Ke ◽  
Lei Qiu ◽  
Chunjin Wang ◽  
Zhenzhong Wang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Edge Effect ◽  
Edge Effects ◽  
Material Removal ◽  
Processing Time ◽  
Grinding Process ◽  
Element Analysis ◽  
Edge Zone ◽  
The Finite Element Analysis

The material removal depth in the pre-polishing stage of the precision optics is usually tens of microns to remove the subsurface damage and grinding marks left by the previous grinding process. This processing of the upstand edge takes a large part of the time at this stage. The purpose of this paper is to develop a method that can reduce the edge effect and largely shorten the processing time of the pre-polishing stage adopting the semirigid (SR) bonnet. The generation of the edge effect is presented based on the finite element analysis of the contact pressure at the edge zone firstly. Then, some experimentations on the edge effect are conducted, and the results proved that the SR bonnet tool can overhang the workpiece edge in the pre-polishing stage to reduce the width and height of the upstand edge to largely shorten the subsequent processing time of it. In addition, there exists a perfect overhang ratio, which generates the upstand edge with the smallest width and height, with no damage to the bonnet tool in the meantime. In addition, one combination of the pre-polishing parameters is concluded according to this method, which can be safely adopted in practical process.

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