Experimental investigation of subsurface damage of optical glass in precision grinding using a brittle material removal fraction

2016 ◽  
Vol 90 (1-4) ◽  
pp. 725-730 ◽  
Author(s):  
Chen Jiang ◽  
Jipeng Xu ◽  
Chunhua Wang
Keyword(s):  
Experimental Investigation ◽  
Brittle Material ◽  
Material Removal ◽  
Optical Glass ◽  
Subsurface Damage ◽  
Precision Grinding ◽  
Brittle Material Removal ◽  
Removal Fraction

scholarly journals Simulation of the ductile machining mode of silicon

2021 ◽  
Author(s):  
Hagen Klippel ◽  
Stefan Süssmaier ◽  
Matthias Röthlin ◽  
Mohamadreza Afrasiabi ◽  
Uygar Pala ◽  
...  
Keyword(s):  
Brittle Material ◽  
Material Removal ◽  
Machining Process ◽  
Ductile Material ◽  
Diamond Wire ◽  
Ductile Machining ◽  
Mesh Free ◽  
Diamond Wire Sawing ◽  
Material Removal Mode ◽  
Brittle Material Removal

AbstractDiamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Under certain conditions, the generally brittle material can be machined in ductile mode, whereby considerably fewer cracks occur in the surface than with brittle material removal. In the presented paper, a numerical model is developed in order to support the optimisation of the machining process regarding the transition between ductile and brittle material removal. The simulations are performed with an GPU-accelerated in-house developed code using mesh-free methods which easily handle large deformations while classic methods like FEM would require intensive remeshing. The Johnson-Cook flow stress model is implemented and used to evaluate the applicability of a model for ductile material behaviour in the transition zone between ductile and brittle removal mode. The simulation results are compared with results obtained from single grain scratch experiments using a real, non-idealised grain geometry as present in the diamond wire sawing process.

scholarly journals Effect of Stress Wave between Adjacent Asperities Interaction on Subsurface Damage of Optical Glass in Precision Grinding

Materials ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1239
Author(s):  
Chen ◽  
Ren ◽  
Lin
Keyword(s):  
Finite Element ◽  
Optical Glass ◽  
Diamond Particle ◽  
Subsurface Damage ◽  
Propagation Mechanism ◽  
Analysis Model ◽  
Precision Grinding ◽  
Element Analysis ◽  
Analysis Process ◽  
Element Simulation

The interaction between adjacent asperities is a typical characteristic of the grinding process and plays an important role in the material removal mechanism. Therefore, in order to systematically investigate the formation mechanism of the subsurface damage, a precision grinding contact model between the diamond particle and optical glass with adjacent asperities is proposed in our research. The initiation and propagation mechanism of median/lateral cracks under residual stress, the propagation rules of the stress waves on the subsurface, and the interaction between the subsurface damage under stress superposition effect are fully investigated by a theoretical analysis and finite element simulation. The simulation results of the precision grinding model are verified by experiments, which show that the proposed numerical analysis model is reasonable and the finite element analysis process is feasible.

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