Surface/Subsurface Damage and Material Removal Mechanism of Glass-ceramics Induced by Ultra-precision Grinding

2017 ◽  
Vol 53 (7) ◽  
pp. 180 ◽  
Author(s):  
Shang GAO
Keyword(s):  
Material Removal ◽  
Glass Ceramics ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Precision Grinding ◽  
Ultra Precision

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0401014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0402014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision

scholarly journals Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

2021 ◽  
Vol 16 (1) ◽  
Author(s):  
Changlin Liu ◽  
Wenbin He ◽  
Jianning Chu ◽  
Jianguo Zhang ◽  
Xiao Chen ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Material Removal ◽  
Subsurface Damage ◽  
Machining Process ◽  
Dynamics Simulation ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Cutting Mechanism ◽  
Hybrid Machining ◽  
Hybrid Machining Process

AbstractIn this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibration cycle. The results indicate that during the hybrid machining process, the dominant material removal mechanism could transform from extrusion to shearing in a single vibration cycle. With an increase of the cutting temperature, the generation and propagation of cracks are effectively suppressed while the swelling appears when the dominant material removal mechanism becomes shearing. The formation mechanism of the subsurface damage in one vibration cycle can be distinct according to the stress distribution. Moreover, the generation of the vacancies in workpiece becomes apparent with increasing temperature, which is an important phenomenon in hybrid machining process.

Crack propagation and the material removal mechanism of glass–ceramics by the scratch test

2016 ◽  
Vol 64 ◽  
pp. 75-85 ◽  
Author(s):  
Zhongjun Qiu ◽  
Congcong Liu ◽  
Haorong Wang ◽  
Xue Yang ◽  
Fengzhou Fang ◽  
...  
Keyword(s):  
Crack Propagation ◽  
Material Removal ◽  
Glass Ceramics ◽  
Scratch Test ◽  
Removal Mechanism ◽  
Material Removal Mechanism

Material removal mechanism of precision grinding of soft-brittle CdZnTe wafers

2009 ◽  
Vol 46 (5-8) ◽  
pp. 563-569 ◽  
Author(s):  
Zhenyu Zhang ◽  
Yaowu Meng ◽  
Dongming Guo ◽  
Lailei Wu ◽  
Yongjun Tian ◽  
...  
Keyword(s):  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Precision Grinding

Experimental Study on the Ultra-Precision Polishing for the Quartz Substrates

2013 ◽  
Vol 797 ◽  
pp. 135-139 ◽  
Author(s):  
Lei Sun ◽  
Wei Gang Guo ◽  
Ju Long Yuan ◽  
Qian Fa Deng ◽  
Ming Feng ◽  
...  
Keyword(s):  
Experimental Study ◽  
Material Removal ◽  
Smooth Surface ◽  
Quartz Substrate ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Polishing Process ◽  
Ultra Precision ◽  
Quartz Substrates

The Quartz substrates are widely used in various fields, and the requirement for the surface quality of quartz substrate is higher than ever before. This paper focuses on the ultra-precision polishing technology for the quartz substrates, and the material removal mechanism in the process of ultra-precision polishing is discussed. The results showed that an extremely smooth surface of quartz substrate was obtained in the ultra-precision polishing process, and the best surface roughness reached Ra 0.82nm. Meanwhile, the thickness can be controlled very well.

Surface and Subsurface Integrity of Glass-Ceramics Induced by Ultra-Precision Grinding

2016 ◽  
Vol 1136 ◽  
pp. 497-502 ◽  
Author(s):  
Bo Zhao ◽  
Shang Gao ◽  
Ren Ke Kang ◽  
Xiang Long Zhu ◽  
Dong Ming Guo
Keyword(s):  
High Surface ◽  
Glass Ceramics ◽  
Subsurface Damage ◽  
Grinding Wheels ◽  
Precision Grinding ◽  
Grain Sizes ◽  
Diamond Grinding ◽  
Hard And Brittle Materials ◽  
Ultra Precision ◽  
Damage Depth

Ultra-precision grinding is widely used in machining of the hard and brittle materials due to its high surface accuracy and machining efficiency. However, grinding inevitably brings about surface and subsurface damage that needs to be removed by the polishing processes. This study investigated the surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding. The characteristics of surface roughness, surface topography and subsurface damage depth of ground glass-ceramics with diamond grinding wheels with different grain sizes were presented and compared. Discussion was also provided to explore corresponding reasons of surface and subsurface integrity induced by diamond grinding wheels with different grain sizes.

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