Characterization of the micro injection-compression molding process for the replication of high aspect ratio micro-structured surfaces

2016 ◽  
Vol 23 (8) ◽  
pp. 3661-3670 ◽  
Author(s):  
Davide Masato ◽  
Marco Sorgato ◽  
Giovanni Lucchetta
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Compression Molding ◽  
Molding Process ◽  
Structured Surfaces ◽  
Injection Compression Molding

REPLICATION BEHAVIOR FOR MICRO SURFACE FEATURES WITH HIGH ASPECT RATIO AND STRUCTURE DEVELOPMENT IN INJECTION COMPRESSION MOLDING

2012 ◽  
Vol 06 ◽  
pp. 563-569 ◽  
Author(s):  
HAJIME SUZUKI ◽  
TETSUO TAKAYAMA ◽  
HIROSHI ITO
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Molecular Orientation ◽  
Orientation Distribution ◽  
Compression Molding ◽  
Short Delay ◽  
Surface Features ◽  
Compression Stroke ◽  
Short Shot ◽  
Injection Compression Molding

Injection compression molding (ICM) with high aspect ratio surface features was performed to clarify the effect of molding conditions on replication characteristics and molecular orientation distribution. Short-shot defects and surface replication were better when using ICM than when using conventional injection molding. A long compression stroke and short delay time condition were optimum conditions to used to achieve uniform surface replication. Molecular orientation was also reduced by the long compression stroke. To reduce molecular orientation, the compression motion should be carried out immediately after injection motion in the case of 0.2 mm thickness. For 0.6 mm thickness, the compression motion was conducted after the shear stress relaxation to reduce the molecular orientation. Short-shot tests revealed distinctive replication behavior in ICM. Results show that replication behavior and local molecular orientation are generated by a slightly frozen layer at the filling area before compression.

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

Analysis and characterization of high-resolution and high-aspect-ratio imaging fiber bundles

2015 ◽  
Vol 54 (32) ◽  
pp. 9422 ◽  
Author(s):  
Nojan Motamedi ◽  
Salman Karbasi ◽  
Joseph E. Ford ◽  
Vitaliy Lomakin
Keyword(s):  
High Resolution ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Fiber Bundles ◽  
Ratio Imaging

The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE Processing

2010 ◽  
Vol 2010 (1) ◽  
pp. 000703-000706
Author(s):  
Colin Stevens ◽  
Robert Dean ◽  
Samuel Lawrence ◽  
Lee Levine
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Measurement Techniques ◽  
Sem Analysis ◽  
Defect Structures ◽  
Mems Devices ◽  
Depth Of Focus ◽  
Surface Conditions ◽  
Side Walls

The Bosch Deep Reactive Ion Etch Process is commonly used for the manufacture of MEMS and MOEMS devices that require deep high aspect ratio trenches. In many cases fully released, high aspect ratio features can be generated in one pass. However the process must be understood to avoid generating some of the defect structures that are characteristic of the process. Defects such as scalloping, silicon grass, and undercutting at the interface of a nonconductive layer can be controlled by process parameters and optimization. Measurement and characterization of the defective structures is a key element of controlling them. The use of SEM measurement techniques for characterizing the small features associated with scalloping and silicon grass is essential. No other technique is capable of providing the large depth of focus required to visualize these features. The use of metallographic techniques furthers understanding of the surface conditions on the side walls of these deep trenches.

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