scholarly journals Stress-Aware Periodic Test of Interconnects

Author(s):  
Somayeh Sadeghi-Kohan ◽  
Sybille Hellebrand ◽  
Hans-Joachim Wunderlich

AbstractSafety-critical systems have to follow extremely high dependability requirements as specified in the standards for automotive, air, and space applications. The required high fault coverage at runtime is usually obtained by a combination of concurrent error detection or correction and periodic tests within rather short time intervals. The concurrent scheme ensures the integrity of computed results while the periodic test has to identify potential aging problems and to prevent any fault accumulation which may invalidate the concurrent error detection mechanism. Such periodic built-in self-test (BIST) schemes are already commercialized for memories and for random logic. The paper at hand extends this approach to interconnect structures. A BIST scheme is presented which targets interconnect defects before they will actually affect the system functionality at nominal speed. A BIST schedule is developed which significantly reduces aging caused by electromigration during the lifetime application of the periodic test.

2013 ◽  
Vol 694-697 ◽  
pp. 872-875
Author(s):  
Jiang Chang ◽  
Fang Wei

Reliability is an important issue to consider for mechanical systems. The state of art is regular checkup and maintenance to ensure normal operations. This is not good enough for safety-critical systems like gearboxes in vehicles and helicopters because the risk of system failure still exists, let alone the manpower and monetary cost required. Prognostics and health management (PHM) was first raised by the U.S. armed force, which should ideally be able to predict faults and schedule maintenance only when necessary by monitoring the system condition. In this paper, inspired by the idea of Built-In Self Test (BIST) in electronic systems, we propose a novel framework to fulfill the task of prognostics and health management with a set of smart sensors, consisting of embedded sensing elements, wireless communication modules and micro-controllers. Both the significance and challenges of the framework are discussed.


2016 ◽  
Vol 136 (12) ◽  
pp. 891-897 ◽  
Author(s):  
Katsuhiro Matsuda ◽  
Kazuhiro Misawa ◽  
Hirotaka Takahashi ◽  
Kenta Furukawa ◽  
Satoshi Uemura

Author(s):  
Elena Yu. Balashova ◽  
◽  
Lika I. Mikeladze ◽  
Elena K. Kozlova ◽  
◽  
...  

Author(s):  
Yasunobu Iwai ◽  
Koichi Shinozaki ◽  
Daiki Tanaka

Abstract Compared with space parts, consumer parts are highly functional, low cost, compact and lightweight. Therefore, their increased usage in space applications is expected. Prior testing and evaluation on space applicability are necessary because consumer parts do not have quality guarantees for space application [1]. However, in the conventional reliability evaluation method, the test takes a long time, and the problem is that the robustness of the target sample can’t be evaluated in a short time. In this report, we apply to the latest TSOP PEM (Thin Small Outline Package Plastic Encapsulated Microcircuit) an evaluation method that combines preconditioning and HALT (Highly Accelerated Limit Test), which is a test method that causes failures in a short time under very severe environmental conditions. We show that this method can evaluate the robustness of TSOP PEMs including solder connections in a short time. In addition, the validity of this evaluation method for TSOP PEM is shown by comparing with the evaluation results of thermal shock test and life test, which are conventional reliability evaluation methods.


2011 ◽  
Vol 31 (1) ◽  
pp. 281-285
Author(s):  
Huan HE ◽  
Zhong-wei XU ◽  
Gang YU ◽  
Shi-yu YANG

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