Designing Interrupted Microchannel Heat Sink with Ribbed Microchambers by Single and Bi-objective Optimizations of Numerical Results

2021 ◽  
Author(s):  
Aparesh Datta ◽  
Santosh Sah ◽  
Arindam Majumder ◽  
Nirmalendu Biswas ◽  
Dipankar Sanyal
Keyword(s):  
Heat Sink ◽  
Numerical Results ◽  
Microchannel Heat Sink

scholarly journals Error Quantification of Nusselt Number Analysis in Miniature Heat Sinks: Verification and Validation Assessment

2021 ◽  
Author(s):  
Mahyar Pourghasemi ◽  
Nima Fathi
Keyword(s):  
Experimental Data ◽  
Water Flow ◽  
Heat Sink ◽  
Numerical Procedure ◽  
Numerical Results ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Microchannel Heat Sink ◽  
Order Of Accuracy ◽  
Nusselt Numbers

Abstract Solution verification is performed to quantify the numerical uncertainty of Nusselt numbers in micro-scale heat sinks obtained from 3-D numerical simulations. A numerical procedure is first developed to calculate local and average Nusselt numbers along 4 different miniature heat sinks. Validation process is performed by comparing the obtained numerical results experimental data. Fairly good agreement between numerical results and experimental data confirms the reliability and accuracy of the proposed numerical procedure. The observed order of accuracy for water flow in a micro-tube with constant uniform heat flux is 1.81 while the observed order of accuracy for conjugate heat transfer of water flow within a microchannel heat sink is estimated as 1.2. The numerical uncertainty for local Nusselt numbers within the investigated microchannel heat sink is estimated to be 0.13.

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

scholarly journals Study on flow and heat transfer of liquid metal in a new top-slotted microchannel heat sink

2021 ◽  
Vol 621 ◽  
pp. 012054
Author(s):  
Zhiwei Chen ◽  
Peng Qian ◽  
Zizhen Huang ◽  
Chengyuan Luo ◽  
Minghou Liu
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Flow And Heat Transfer
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