Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process

Mechanical Polishing ◽

Wafer Surface ◽

Polishing Process ◽

A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-003-1544-y ◽

2003 ◽

Vol 22 (5-6) ◽

pp. 401-409 ◽

Cited By ~ 29

Author(s):

Yeou-Yih Lin ◽

Ship-Peng Lo

Keyword(s):

Mechanical Polishing ◽

Wafer Surface ◽

Polishing Process ◽

A New Model for the Indentation Depth of a Particle into the Wafer Surface in Chemical Mechanical Polishing Process

International Journal of Comprehensive Engineering ◽

10.14270/ijce2013.2.4.c332 ◽

2013 ◽

Vol 2 (4) ◽

pp. c332

Keyword(s):

Indentation Depth ◽

Mechanical Polishing ◽

Wafer Surface ◽

Polishing Process ◽

New Model ◽

The prediction of wafer surface non-uniformity using FEM and ANFIS in the chemical mechanical polishing process

Journal of Materials Processing Technology ◽

10.1016/j.jmatprotec.2005.01.010 ◽

2005 ◽

Vol 168 (2) ◽

pp. 250-257 ◽

Cited By ~ 35

Author(s):

Ship-Peng Lo ◽

Yeou-Yih Lin

Keyword(s):

Mechanical Polishing ◽

Wafer Surface ◽

Polishing Process ◽

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ◽

Effect of temperature on copper damascene chemical mechanical polishing process

10.1116/1.2825143 ◽

2008 ◽

Vol 26 (1) ◽

pp. 141 ◽

Cited By ~ 13

Author(s):

Veera Raghava Kakireddy ◽

Subrahmanya Mudhivarthi ◽

Ashok Kumar

Keyword(s):

Mechanical Polishing ◽

Effect Of Temperature ◽

Polishing Process ◽

Integrated Tungsten Chemical Mechanical Polishing Process Characterization for Via Plug Interconnection in Ultralarge Scale Integrated Circuits

Japanese Journal of Applied Physics ◽

10.1143/jjap.41.5120 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5120-5124 ◽

Cited By ~ 5

Author(s):

Chin-Kun Wang ◽

Hua-Shu Wu ◽

Nai-Tien Ou ◽

Huang-Chung Cheng

Keyword(s):

Integrated Circuits ◽

Mechanical Polishing ◽

Polishing Process ◽

Process Characterization ◽

Characterization of a New Cleaning Method Using Electrolytic Ionized Water for Polysilicon Chemical Mechanical Polishing Process

Japanese Journal of Applied Physics ◽

10.1143/jjap.41.5098 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5098-5103 ◽

Cited By ~ 6

Author(s):

Naoto Miyashita ◽

Shin-ichiro Uekusa ◽

Hiroshi Katumata

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Cleaning Method ◽

Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-007-1124-7 ◽

2007 ◽

Vol 38 (7-8) ◽

pp. 674-682 ◽

Cited By ~ 36

Author(s):

Hsin-Te Liao ◽

Jie-Ren Shie ◽

Yung-Kuang Yang

Keyword(s):

Design Of Experiments ◽

Process Parameters ◽

Mechanical Polishing ◽

Polishing Process ◽

Ultrafiltration based on various polymeric membranes for recovery of spent tungsten slurry for reuse in chemical mechanical polishing process

Journal of Membrane Science ◽

10.1016/j.memsci.2017.11.034 ◽

2018 ◽

Vol 548 ◽

pp. 232-238 ◽

Cited By ~ 2

Author(s):

Nur Fatin Amalina Muhammad Sanusi ◽

Mohd Hizami Mohd Yusoff ◽

Ooi Boon Seng ◽

Mohd Sabirin Marzuki ◽

Ahmad Zuhairi Abdullah

Keyword(s):

Polymeric Membranes ◽

Mechanical Polishing ◽

Polishing Process ◽

A Dynamic Thermal Modeling of Chemical Mechanical Polishing Process

Transactions of the Korean Society of Mechanical Engineers A ◽

10.3795/ksme-a.2004.28.5.617 ◽

2004 ◽

Vol 28 (5) ◽

pp. 617-623

Keyword(s):

Thermal Modeling ◽

Mechanical Polishing ◽

Polishing Process ◽

Removal of scratch on the surface of MgO single crystal substrate in chemical mechanical polishing process

Applied Surface Science ◽

10.1016/j.apsusc.2008.01.150 ◽

2008 ◽

Vol 254 (15) ◽

pp. 4856-4863 ◽

Cited By ~ 11

Author(s):

R.K. Kang ◽

K. Wang ◽

J. Wang ◽

D.M. Guo

Keyword(s):

Single Crystal ◽

Mechanical Polishing ◽

Single Crystal Substrate ◽

Polishing Process ◽

Crystal Substrate ◽