Effect of shear bond failure on the strength ratio in DEM modeling of quasi-brittle materials

2021 ◽  
Author(s):  
Yifei Ma ◽  
Haiying Huang
Author(s):  
B. J. Hockey

Ceramics, such as Al2O3 and SiC have numerous current and potential uses in applications where high temperature strength, hardness, and wear resistance are required often in corrosive environments. These materials are, however, highly anisotropic and brittle, so that their mechanical behavior is often unpredictable. The further development of these materials will require a better understanding of the basic mechanisms controlling deformation, wear, and fracture.The purpose of this talk is to describe applications of TEM to the study of the deformation, wear, and fracture of Al2O3. Similar studies are currently being conducted on SiC and the techniques involved should be applicable to a wide range of hard, brittle materials.


2000 ◽  
Vol 10 (PR9) ◽  
pp. Pr9-811-Pr9-816 ◽  
Author(s):  
O. A. Plekhov ◽  
D. N. Eremeev ◽  
O. B. Naimark

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.


1984 ◽  
Author(s):  
S. M. Wiederhorn ◽  
N. J. Tighe ◽  
T. J. Chuang ◽  
K. A. Hardman-Rhyne ◽  
B. J. Hockey

2005 ◽  
Author(s):  
Michael A. Grinfeld ◽  
Scott E. Schoenfeld ◽  
Tim W. Wright

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