Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder

2020 ◽  
Vol 49 (4) ◽  
pp. 2660-2668 ◽  
Author(s):  
Jianglei Fan ◽  
Hengtao Zhai ◽  
Zhanyun Liu ◽  
Xiao Wang ◽  
Xiangkui Zhou ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Microstructure Evolution ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Microstructure Evolution of Sn-3Ag-3Bi-3In/Cu Lead-free Solder Joints during Interval Aging

2018 ◽  
Vol 394 ◽  
pp. 022036
Author(s):  
Min Qu ◽  
Tianze Cao ◽  
Yan Cui ◽  
Fengbin Liu ◽  
Zhiwei Jiao ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Effect of Pr on Wettability and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder

2015 ◽  
Vol 1120-1121 ◽  
pp. 456-461
Author(s):  
Xiao Le Feng ◽  
Jie Yang
Keyword(s):  
Mechanical Properties ◽  
Mechanical Property ◽  
Shear Stress ◽  
Mass Fraction ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Wetting Time ◽  
Free Solder ◽  
Wetting Force

The wettability of Sn-0.3Ag-0.7Cu-xPr solders on Cu substrate was determined by the wetting balance method， and the mechanical properties of Sn-0.3Ag-0.7Cu-xPr joints were investigated. The result showed that the wetting force of Sn-0.3Ag-0.7Cu-xPr is increased and the wetting time is decreased with the Pr content addition. Good wettability of Sn-Ag-Cu-Pr is obtained with around 0·05%-0·1% (mass fraction) Pr. When measured at 260°C， the wetting force of of SnAgCu solder was increased by 5.0% with 0.1%Pr and the wetting time of SnAgCu solder was descreased by 16.9%.The mechanical properties of soldered joints are enhanced with the addition of Pr， and the soldered joints possess the peak values of shear stress when the Pr addition is about 0.05% in Sn-Ag-Cu-Pr solder joint.

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

2017 ◽  
Vol 728 ◽  
pp. 992-1001 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Min-Su Kim ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Free Solder
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