Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging

2021 ◽  
Author(s):  
Xianwen Peng ◽  
Yue Wang ◽  
Zheng Ye ◽  
Jihua Huang ◽  
Jian Yang ◽  
...  
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Power Device ◽  
Core Shell ◽  
Transient Liquid Phase Sintering ◽  
Shell Particles

Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Applied Pressure ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Thermally Stable ◽  
Bonding System ◽  
Cu Substrates ◽  
Transient Liquid Phase Sintering

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.

High Temperature Sintered Interconnects Formed by Transient Liquid Phase Sintering

2013 ◽  
Vol 2013 (1) ◽  
pp. 000951-000956 ◽  
Author(s):  
Hannes Greve ◽  
F. Patrick McCluskey
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Low Temperature ◽  
Melting Temperature ◽  
Extreme Temperature ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Temperature Conditions ◽  
Transient Liquid Phase Sintering

Low Temperature Transient Liquid Phase Sintering (LT-TLPS) enables the formation of joints robust to high temperatures at low process temperatures. TLPS systems consist of one or more low temperature constituents (i.e. Sn) and one or more high temperature constituents (i.e. Cu). The sinter joints are formed by intermetallic compound formation between these constituents. In this paper a paste based LT-TLPS approach is demonstrated. The organic binders and fluxes used to mix the pastes prevent the metal particles from oxidation and facilitate a vacuum-free process in air without the need of a reducing atmosphere. Pastes based on the Cu-Sn system have been developed enabling a completely pressure-less process. Furthermore sinter pastes for LT-TLPS at low pressure (<0.5MPa) applied during the initial stage of the sintering process have been developed which form almost void free joints. To assess the strength of the sintered joints a high-temperature shear fixture has been designed. Shear tests have been performed at 25°C, 400°C, and 600°C to characterize the influence of high temperature conditions on the joint performance. The shear strength of the joints formed without pressure has been assessed for different Cu-to-Sn ratios at all temperature levels. It is shown that the maximum application temperature and shear strength depends on the ratio of low melting temperature and high melting temperature constituents. The pastes introduced here can be used to form joints resilient to application temperatures of up to 600°C. They show the potential to form joints for reliable operation under extreme temperature conditions.

Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachment

2015 ◽  
Vol 2015 (1) ◽  
pp. 000459-000464 ◽  
Author(s):  
John McConnell ◽  
J. Bultitude ◽  
J. Qazi ◽  
J. Magee ◽  
C. Shearer ◽  
...  
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Potential Applications ◽  
Operating Temperatures ◽  
Transient Liquid Phase Sintering ◽  
Compliant Interconnect ◽  
Initial Processing ◽  
Oil Gas

Transient Liquid Phase Sintering is a process that provides high temperature Pb-free RoHS compliant interconnect solutions that exceed the high temperature capabilities of Pb-Sn solders. KEMET, working in collaboration with Ormet Circuits Inc. has successfully applied Ormet's TLPS technology to a line of Leaded Multi-layer Ceramic Capacitors (MLCC) components for high temperature applications. The material is Pb-free, RoHS compliant and able to withstand process and operating temperatures > 400°C while having initial processing temperatures of less than 300°C. Potential applications for TLPS are in the automotive, aerospace, oil, gas, and geothermal exploration industries where electronics are being exposed to higher operating temperatures and require robust interconnects capable of withstanding harsh environments.

scholarly journals Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications

ETRI Journal ◽  
2019 ◽  
Vol 41 (6) ◽  
pp. 820-828 ◽  
Author(s):  
Yong‐Sung Eom ◽  
Keon‐Soo Jang ◽  
Ji‐Hye Son ◽  
Hyun‐Cheol Bae ◽  
Kwang‐Seong Choi
Keyword(s):  
Liquid Phase ◽  
High Power ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Conductive Adhesive ◽  
Power Device ◽  
Device Applications ◽  
Transient Liquid Phase Sintering
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