Abstract
Plastic products are common in contemporary daily lives. In the plastics industry, the injection molding process is advantageous for features such as mass production and stable quality. The problem, however, is that the melt will be affected by the residual stress and shrinkage generated in the process of filling and cooling; hence, defects such as warping, deformation, and sink marks will occur. In order to reduce product deformation and shrinkage during the process of molding, the screw of the injection molding machine will start the packing stage when filling is completed, which continuously pushes the melt into the cavity, thus making up for product shrinkage and improving their appearance, quality, and strength. If the packing pressure is too high, however, the internal residual stress will increase accordingly. This study set out to apply gas counter pressure (GCP) in the injection molding process. By importing gas through the ends of the cavity, the melt was exposed to a melt front pressure, which, together with the packing pressure from the screw, is supposed to reduce product shrinkage. The aim was to investigate the impacts of GCP on the process parameters via the changes in machine feedback data, such as pressure and the remaining injection resin. This study also used a relatively thin plate-shaped product and measurements, such as the photoelastic effect and luminance meter, to probe into the impacts of GCP on product residual stress, while a relatively thick paper-clip-shaped product was used to see the impacts of GCP on shrinkage in thick parts. According to the experimental results, the addition of GCP resulted in increased filling volume, improvement of product weight and stability, and effective reduction of section shrinkage, which was most obvious at the point closest to the gas entrance. The shrinkage of the sections parallel and vertical to the flow direction was proved to be reduced by 32% and 16%, respectively. Moreover, observations made via the polarizing stress viewer and luminance meter showed that the internal residual stress of a product could be effectively reduced by a proper amount of GCP.
The Residual Stress Simulation Analysis of the Vacuum Eutectic Soldering for Metal and LTCC Substrate
