Study on forced air convection cooling for electronic assemblies

2008 ◽  
Vol 2 (2) ◽  
pp. 158-163 ◽  
Author(s):  
Bin Li ◽  
Wenquan Tao ◽  
Yaling He
Solar Energy ◽  
2021 ◽  
Vol 220 ◽  
pp. 24-34
Author(s):  
Letícia Ferraresi Hidalgo ◽  
Mariana Nascimento Candido ◽  
Karina Nishioka ◽  
José Teixeira Freire ◽  
Gustavo Nakamura Alves Vieira

2017 ◽  
Vol 2017 (NOR) ◽  
pp. 1-7
Author(s):  
Peter Uhlig ◽  
Alexandra Serwa ◽  
Ulrich Altmann ◽  
Tilo Welker ◽  
Jens Müller ◽  
...  

Abstract Low Temperature Co-fired Ceramic (LTCC) is a proven packaging technology for microwave and millimetre-wave applications. Advanced low-loss material systems and improved manufacturing technology facilitate economic and highly reliable packaging solutions for automotive, telecom, medical and security applications. The fact that the substrate is hermetic facilitates unique packaging concepts where the LTCC multilayer is part of a hermetic package. However, there is a trade-off for the increasing complexity of these modules: When active devices are involved, the density of power dissipation is also rising. Liquid cooling provides an alternative where (forced air) convection cooling is not possible for lack of space or because of other limitations. With the integration of micro-channels into the LTCC-multilayer-stack the microwave-substrate becomes part of the piping for liquid cooling and brings the coolant in close contact to the heat source. As an example for such a solution a switched mode amplifier shall be presented that uses liquid cooling for the power transistor. Two different approaches for the routing of the cooling channels inside the LTCC are compared with cooling on a metal block at constant temperature. For the exact determination of all parameters, dissipated power and temperature on the die (junction temperature) a thermal test die is used instead of the transistor for the test vehicles.


Author(s):  
Nick Hofmann ◽  
Michael P. Hennessey

Due to recent technological developments in advanced materials, the integration of shape memory alloys (SMAs) into new machines and mechanisms is becoming more common and it offers tremendous potential for the future. Using currently available properties of common SMA materials, the paper’s contribution is to: Study through dynamic simulation the potential offered by SMA springs to serve as the basis for rotary actuation. In the process, the SMA displaces a rocker arm rotating about an axis to induce rotational motion of a driveshaft, in effect converting a force into rotational motion. When embedded in a cycle with heating & cooling phases and a resetting mechanism, unidirectional rotational motion can be achieved. Regarding heating and cooling cycles, forced air convection is used to reduce thermal cycle cooling and is calculated via transient thermal analyses. Using typical parameter values for the representative design considered, through forced air convection, cooling cycles are reduced from approximately 30 seconds (natural) to 5.5 seconds (forced) and as a result, a complete system cycle can occur in 10 seconds, with the applied inertial load of 2.0 kg-m2. Using MATLAB and Simulink, a nonlinear 3rd order dynamic system model was created and simulations were performed. One complicating factor concerned angular limits and the necessary thermal cycling, which was solved through appropriate sequencing and resetting of integrators for different phases. Simulation results for the design considered show that a peak torque of 1.72 N-m is possible and that relatively smooth motion and approximately constant torque output is also possible through the addition of a few more rocker arm systems, properly commutated. Lastly, the design analysis framework and results may inspire future realization of actual devices.


Meat Science ◽  
2001 ◽  
Vol 58 (3) ◽  
pp. 239-246 ◽  
Author(s):  
T.E Lawrence ◽  
D.A King ◽  
E Obuz ◽  
E.J Yancey ◽  
M.E Dikeman

2002 ◽  
Vol 96 (Sup 2) ◽  
pp. A505
Author(s):  
Kenji Hasegawa ◽  
Chiharu Negishi ◽  
Fumitoshi Nakagawa ◽  
Makoto Ozaki ◽  
Daniel I. Sessler

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