Heat transfer performance testing of a new type of phase change heat sink for high power light emitting diode

Thermal management is crucial to guarantee the normal operation of light-emitting diodes (LEDs) Phase change heat sink is superior to traditional metal solid heat sink due to very small thermal resistance. In this study, a new type of phase change heat sink for high power LEDs is first designed. Then, the fabrication process of boiling structures at the evaporation surface of the phase change heat sink is discussed and analyzed. To make a comparison and deep discussion, the machining process is simulated through the FEM (finite element analysis) software, DEFORM-3D. Last but not least, heat transfer performance of the fabricated phase change heat sink is tested. Results have shown that the designed new type of phase change heat sink has superior heat transfer performance and is suitable for heat dissipation of high-power LEDs.

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Optimization of Flow and Heat Transfer for a New Double-Layered Microchannel Heat Sink

ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer ◽

10.1115/mnhmt2019-3967 ◽

2019 ◽

Author(s):

Huanling Liu ◽

Bin Zhang

Keyword(s):

Heat Transfer ◽

Heat Sink ◽

Heat Transfer Performance ◽

Microchannel Heat Sink ◽

Transfer Performance ◽

Temperature Uniformity ◽

Flow And Heat Transfer ◽

Fluent Simulation ◽

New Type ◽

Improved Design

Abstract In this paper, we propose a new type of DL-MCHS to improve the substrate temperature uniformity of the microchannel heat sink, and conduct the optimization of the New DL-MCHS. The heat transfer and friction characteristics of the novel DL-MCHS are studied by numerical simulation. We compare the heat transfer performance the new DL-MCHS with the traditional TDL-MCHS (the DL-MCHS with truncated top channels λ = 0.38). The results prove the effectiveness of the improved design by FLUENT simulation. When the inlet velocity is kept constant and coolant is water, the heat transfer performance of the New DL-MCHS is higher than that of TDL-MCHS leading to an increase of the temperature uniformity. In order to achieving the best overall heat transfer performance, an optimization of New DL-MCHS is performed by GA (genetic algorithm).

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Heat transfer performance of a novel tubular oscillating heat pipe with sintered copper particles inside flat-plate evaporator and high-power LED heat sink application

Energy Conversion and Management ◽

10.1016/j.enconman.2019.03.093 ◽

2019 ◽

Vol 189 ◽

pp. 215-222 ◽

Cited By ~ 10

Author(s):

Hai Wang ◽

Jian Qu ◽

Youquan Peng ◽

Qin Sun

Keyword(s):

Heat Transfer ◽

Flat Plate ◽

Heat Pipe ◽

High Power ◽

Heat Sink ◽

Heat Transfer Performance ◽

Transfer Performance ◽

Oscillating Heat Pipe ◽

Copper Particles ◽

Sintered Copper

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Effect of the time-dependent volumetric heat flux on heat transfer performance inside a heat sink based on the phase change materials

Clean Technologies and Environmental Policy ◽

10.1007/s10098-020-01818-x ◽

2020 ◽

Cited By ~ 1

Author(s):

Nadezhda S. Bondareva ◽

Mikhail A. Sheremet

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Phase Change ◽

Heat Sink ◽

Phase Change Materials ◽

Heat Transfer Performance ◽

Time Dependent ◽

Transfer Performance

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Numerical Investigation of Heat Transfer Performance of Phase Change Material Slurries in Micro channels for Cooling of High Power Electronic Devices

International Journal for Research in Applied Science and Engineering Technology ◽

10.22214/ijraset.2018.1124 ◽

2018 ◽

Vol 6 (1) ◽

pp. 811-819

Author(s):

Mir Meher Ali

Keyword(s):

Heat Transfer ◽

Phase Change ◽

Numerical Investigation ◽

High Power ◽

Heat Transfer Performance ◽

Electronic Devices ◽

Transfer Performance ◽

Power Electronic ◽

Micro Channels ◽

Change Material

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Forming technology of boiling structure on evaporation surface of phase-change heat sink for high-power light emitting diode

Journal of Central South University of Technology ◽

10.1007/s11771-010-0520-6 ◽

2010 ◽

Vol 17 (3) ◽

pp. 544-548 ◽

Cited By ~ 4

Author(s):

Jian-hua Xiang ◽

Bang-yan Ye ◽

Yong Tang ◽

Wei Zhou ◽

Zhi-hua Hu

Keyword(s):

Phase Change ◽

High Power ◽

Heat Sink ◽

Light Emitting Diode ◽

Evaporation Surface ◽

Light Emitting ◽

Forming Technology

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A Novel Heat Sink for High Power Light Emitting Diode-Phase Change Heat Sink

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.50-51.278 ◽

2011 ◽

Vol 50-51 ◽

pp. 278-282

Author(s):

J.H. Xiang ◽

Xiao Chu Liu ◽

Chun Liang Zhang ◽

Yong Tang

Keyword(s):

Phase Change ◽

High Power ◽

Heat Sink ◽

Light Emitting Diode ◽

Internal Surface ◽

Input Power ◽

Light Emitting ◽

Sintered Copper ◽

Transfer Capability ◽

Enhanced Boiling

A novel heat sink was fabricated for packaging cooling of high power LED. Enhanced boiling structures in the evaporation surface were processed by ploughing-extrusion (P-E) and stamping methods, respectively. The cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. The experimental results showed that phase change heat sink was provided with a good heat transfer capability and the temperature of phase change heat sink reached 86.8°C under input power of 10W LED at ambient temperature of 20°C.

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