scholarly journals Numerical Simulation, Machining and Testing of a Phase Change Heat Sink for High Power LEDs

Materials ◽  
2019 ◽  
Vol 12 (13) ◽  
pp. 2193 ◽  
Author(s):  
Jianhua Xiang ◽  
Haoxing Zheng ◽  
Yipin Wang ◽  
Chunliang Zhang ◽  
Chao Zhou ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Phase Change ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Machining Process ◽  
Normal Operation ◽  
Transfer Performance ◽  
New Type

Thermal management is crucial to guarantee the normal operation of light-emitting diodes (LEDs) Phase change heat sink is superior to traditional metal solid heat sink due to very small thermal resistance. In this study, a new type of phase change heat sink for high power LEDs is first designed. Then, the fabrication process of boiling structures at the evaporation surface of the phase change heat sink is discussed and analyzed. To make a comparison and deep discussion, the machining process is simulated through the FEM (finite element analysis) software, DEFORM-3D. Last but not least, heat transfer performance of the fabricated phase change heat sink is tested. Results have shown that the designed new type of phase change heat sink has superior heat transfer performance and is suitable for heat dissipation of high-power LEDs.

scholarly journals Finite Element Simulation of the Machining Process of Boiling Structures in a Novel Radial Heat Sink for High-Power LEDs

Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 3958
Author(s):  
Jianhua Xiang ◽  
Zeyu Liu ◽  
Chunliang Zhang ◽  
Chao Zhou ◽  
Conggui Chen
Keyword(s):  
Heat Transfer ◽  
Plastic Deformation ◽  
Finite Element ◽  
Phase Change ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Machining Process ◽  
High Power Led ◽  
Radial Heat

A phase change heat sink has higher heat transfer efficiency compared to a traditional metal solid heat sink, and is thus more preferred for the heat dissipation of high-power light-emitting diodes (LEDs) with very high heat flux. The boiling structure at the evaporation surface is the biggest factor that affects heat sink resistance. It is necessary to investigate the plastic deformation law during the machining process of boiling structures. In this study, a novel phase change radial heat sink was developed for high-power LED heat dissipation. First, a working principle and a fabrication process for the heat sink were introduced. Subsequently, to achieve an excellent heat dissipation performance, the machining process of boiling structures was numerically simulated and investigated. To be specific, plastic deformation generated during the formation was analyzed, and key parameters related to the morphology of the boiling structures were discussed including feeding angles and machining depths. Moreover, the finite element (FE) simulation results were compared with those of experiments. Last but not least, the heat transfer performance of the fabricated heat sink was tested. Results showed that the developed heat sink was well suited for a high-power LED application.

Optimization of Flow and Heat Transfer for a New Double-Layered Microchannel Heat Sink

2019 ◽  
Author(s):  
Huanling Liu ◽  
Bin Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Microchannel Heat Sink ◽  
Transfer Performance ◽  
Temperature Uniformity ◽  
Flow And Heat Transfer ◽  
Fluent Simulation ◽  
New Type ◽  
Improved Design

Abstract In this paper, we propose a new type of DL-MCHS to improve the substrate temperature uniformity of the microchannel heat sink, and conduct the optimization of the New DL-MCHS. The heat transfer and friction characteristics of the novel DL-MCHS are studied by numerical simulation. We compare the heat transfer performance the new DL-MCHS with the traditional TDL-MCHS (the DL-MCHS with truncated top channels λ = 0.38). The results prove the effectiveness of the improved design by FLUENT simulation. When the inlet velocity is kept constant and coolant is water, the heat transfer performance of the New DL-MCHS is higher than that of TDL-MCHS leading to an increase of the temperature uniformity. In order to achieving the best overall heat transfer performance, an optimization of New DL-MCHS is performed by GA (genetic algorithm).

Experimental Study on Heat Transfer Performance of Pulsating Heat Pipe CPU Radiator

2019 ◽  
Author(s):  
Fu-Min Shang ◽  
Qing-Jing Yang ◽  
Jian-Hong Liu
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Wall Temperature ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Structural Characteristics ◽  
Hot Water ◽  
Transfer Performance ◽  
Pulsating Heat Pipe

Abstract According to the characteristics of heat dissipation process and the structural characteristics of traditional heat dissipation device, pulsating heat pipe (PHP) and traditional The pin-finned heat sink are used to simulate the cooling process of CPU, so as to meet the cooling requirements of computer CPU. By comparing the heat transfer perform of the two heat sinks under three conditions: the top wall temperature of the heat sink, the wall temperature of the heat sink and the temperature difference between the inlet and outlet of hot water, it can be found that the heat transfer performance of the PHP radiator is better. The experimental results show that in order to further improve the heat dissipation performance of the computer CPU, the CPU radiator device can be manufactured by the PHP device, and the PHP technology has broad application prospects in electronic heat dissipation.

Structural Optimization and Heat Transfer Performance Analysis of a Cone-Column Combined Heat Sink

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Zheng Wei ◽  
Sun Jianjun ◽  
Niu Tao ◽  
Ma Chenbo ◽  
Yu Qiuping ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pore Size ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Orthogonal Test ◽  
Test Method ◽  
Normal Operation ◽  
Microchannel Heat Sink ◽  
Transfer Performance ◽  
The Impact

Abstract To address the impact of temperature on the normal operation and service life of high-power electronic components, a circular microchannel heat sink with cones has been designed. The cones are evenly arranged inside circular microchannels, which can change the flow state of the cooling medium in the microchannels and enhance the heat transfer performance. The experimental scheme of the heat transfer performance of microchannel heat sink was designed by an orthogonal test method, and the numerical simulation was carried out by ansys thermal-fluid–solid coupling. Within the test parameters, the inlet pore size, the split outer diameter, and the number of cone columns have effect the temperature of the heat sink base. Further, the inlet pore size and the number of cone columns have a heightened effect on the test results: the base temperature of the heat sink decreases rapidly with the increase in the inlet pore size and the number of cone columns. According to the orthogonal test analysis, the structural parameters of the heat sink were optimized. Under the condition that the other boundary conditions are the same, the temperature of the heat sink substrate obtained by the new factor levels combination is 27.87 °C.

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