Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

2013 ◽  
Vol 20 (9) ◽  
pp. 883-889 ◽  
Author(s):  
Guo-qiang Wei ◽  
Lei Wang ◽  
Xin-qiang Peng ◽  
Ming-yang Xue
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Intermetallic Compound Growth ◽  
Interfacial Intermetallic Compound ◽  
Free Solder

Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

2015 ◽  
Vol 815 ◽  
pp. 109-114 ◽  
Author(s):  
Yuan Wang ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Jing Wei Cheng ◽  
Hong Li ◽  
...  
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Melting Temperature ◽  
Hot Spot ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interfacial Intermetallic Compound ◽  
Free Solder

The research on a new low-Ag lead-free solder has become a hot spot in the field of electronic packaging. In this work, the effects of Bi addition on microstructure, melting temperature, wettability of low-Ag solder, shear strength of solder joint and the growth of interfacial intermetallic compound (IMC) before and after thermal cycling were investigated. A moderate amount of Bi element resulted in the microstructural refinement and melting temperature reduction of Sn-0.2Ag-0.7Cu solder. Wetting test results showed that a small amount of Bi produced the significant effect on improving the wettability. In addition, it is shown that the thickness of interfacial IMC during thermal cycling decreased first and then increased; the shear strength of solder joint increased with the increase of Bi.

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

2019 ◽  
Vol 99 ◽  
pp. 62-73 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Jun-Hyuk Son ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Intermetallic Compound Growth ◽  
Free Solder
Sign in / Sign up

Export Citation Format

Share Document