Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

2018 ◽  
Vol 54 (2) ◽  
pp. 1741-1768 ◽  
Author(s):  
Ming-yue Xiong ◽  
Liang Zhang
Keyword(s):  
Intermetallic Compound ◽  
Electronic Packaging ◽  
Solder Joints ◽  
Interface Reaction ◽  
Growth Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Intermetallic Compound Growth ◽  
Free Solder

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

2011 ◽  
Vol 27 (8) ◽  
pp. 741-745 ◽  
Author(s):  
T.Y. Kang ◽  
Y.Y. Xiu ◽  
L. Hui ◽  
J.J. Wang ◽  
W.P. Tong ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Lead Free ◽  
Lead Free Solder ◽  
Intermetallic Compound Growth ◽  
Free Solder

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

2019 ◽  
Vol 99 ◽  
pp. 62-73 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Jun-Hyuk Son ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Intermetallic Compound Growth ◽  
Free Solder
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