Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time
2015 ◽
Vol 68
(6)
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pp. 1027-1031
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2015 ◽
Vol 830-831
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pp. 215-218
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2002 ◽
Vol 5
(2)
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pp. 152-158
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2010 ◽
Vol 507
(1)
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pp. 290-296
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2003 ◽
Vol 360
(1-2)
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pp. 217-224
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2020 ◽
Vol 30
(7)
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pp. 49-53
2017 ◽
Vol 6
(1)
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pp. MPC20160058
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