Effect of Cooling Rate on Joint Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

2017 ◽  
Vol 6 (1) ◽  
pp. MPC20160058
Author(s):  
Sanjay Tikale ◽  
Mrunali Sona ◽  
K. Narayan Prabhu
Keyword(s):  
Shear Strength ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Joint Shear Strength ◽  
Lead Free Solder Alloy ◽  
Joint Shear ◽  
Free Solder

Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

2015 ◽  
Vol 830-831 ◽  
pp. 215-218 ◽  
Author(s):  
Sanjay Tikale ◽  
Mrunali Sona ◽  
K.N. Prabhu
Keyword(s):  
Shear Strength ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Bulk Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Bond Shear Strength ◽  
Lead Free Solder Alloy ◽  
Free Solder

Lead-free solders are environment friendly and are in great demand for microelectronic applications. In the present study, Sn-9Zn lead free solder alloy was solidified on Cu substrate for different reflow times from 10 to 1000s. The influence of reflow time on wetting, formation of intermetallic compounds (IMCs) and bond shear strength was studied using dynamic contact angle analyzer, bond tester and scanning electron microscopy. The results indicate that, the wettability of the solder alloy increased with increase in reflow time. Microstructure study revealed the presence of Cu5Zn8 and CuZn5 IMCs at the interface. The thickness of an IMC increased with increase in the reflow time. The mean thickness of about 11μm for Cu5Zn8 IMC layer was observed for the reflow time of 1000s. The thickness of CuZn5 layer increased up to a reflow time of 100s and decreases thereafter. The bond shear strength increased up to 100s and decreased with increase in reflow time. The decrement in shear strength at higher reflow time is mainly due to excessive thickness of Cu5Zn8 IMC layer and diffusion of Sn from bulk solder towards the substrate. The excessive thick IMC layer exhibited pre micro-cracks led to the brittle failure of bond under the influence of shear stress.

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate

2010 ◽  
Vol 507 (1) ◽  
pp. 290-296 ◽  
Author(s):  
Ervina Efzan Mhd Noor ◽  
Nurulakmal Mohd Sharif ◽  
Cheong Kuan Yew ◽  
Tadashi Ariga ◽  
Ahmad Badri Ismail ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Contact Angle of Sn-8Zn-3Bi Lead-free Solder Alloy on Copper Substrate

2020 ◽  
Vol 30 (7) ◽  
pp. 49-53
Author(s):  
Ngoc Binh Duong
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Effect Of Temperature ◽  
Lead Free Solder ◽  
Experimental Conditions ◽  
Lead Free Solder Alloy ◽  
Free Solder

The wettability of Sn-8Zn-3Bi lead free solder alloy on the copper substrate was evaluated via measuring the contact angle of the solder and the substrate. The measured contact angle was then compared to the contact angle of the traditional and widely used eutectic Sn-37Pb solder alloy. Experiments to study the effect of temperature, flux, and surface roughness of the substrate on the contact angle were also carried out. The results show that the contact angle of Sn-8Zn-3Bi on copper substrate decreased as temperature increases. The minimum value of the contact angle obtained was approximately 23° for Sn-8Zn-3Bi. At the same experimental conditions, contact angle of Sn-8Zn-3Bi is higher than that of Sn-37Pb. When three types of fluxes were used, at 230°C, contact angle of Sn-8Zn-3Bi has the smallest value with the MHS37 flux, 25°, and it has the largest value with the zinc chloride flux, 47°. The surface roughness of the substrate has little influence on contact angle of Sn-8Zn-3Bi on copperand the contact angle has changed a few degrees as the roughness changed.

Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan

2013 ◽  
Vol 315 ◽  
pp. 675-680 ◽  
Author(s):  
Efzan M.N. Ervina ◽  
S.Y. Tan
Keyword(s):  
Contact Angle ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Temperature ◽  
Ε Phase ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Significant Increment

This work presents the studies of wettability Sn-6Zn-4Bi lead-free solder alloy in electronic applications. A reference solder Sn-3.1Ag-0.9 Cu lead-free solder alloy is used to compare the properties of both solders. Differential Scanning Calorimeter (DSC) profile, wettability and the microstructure of the solder were investigated. The melting temperature of Sn-Zn-Bi (Tm=194.97°C) is lower than Sn-Ag-Cu (Tm=220.40°C). Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for Sn-Ag-Cu was decreasing from 28.23º to 24.97º and for Sn-Zn-Bi solder alloys were decreasing from 48.92º to 29.78º as the temperature increased from 230°C to 250°C. A significant increment of contact angle for Sn-Zn-Bi at 270°C and the contact angle did not change at 270°C for Sn-Ag-Cu. The result of spreading area is inversed with the contact angle. The layers of intermetallic compound were examined by energy-dispersive X-ray. The Sn-Zn-Bi solder exhibits a mixture of Cu-Sn+Cu-Zn phase and ϒ-Cu5Zn8phase. The Sn-Ag-Cu solder exhibits Cu6Sn5 (η-phase) and Cu3Sn (ε-phase). As a conclusion, Sn-Zn-Bi is a potential lead-free solder to develop based on its wettability properties than previous available solder materials.

Experimental Investigation of the Effect of Reflow Cooling Rate on the IMC Growth of SAC Lead-Free Solder Alloy

2005 ◽  
Author(s):  
Fubin Song ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Room Temperature ◽  
Solder Ball ◽  
Ternary Eutectic ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

The present research is conducted to investigate a critical issue for Lead-free solder alloy. Near-ternary eutectic Sn-Ag-Cu alloys have been studied since they are the leading Lead-free candidate solders for various applications. There are three main phases in the near-ternary eutectic alloys: β-Sn rich phase, Ag3Sn and Cu6Sn5. Cooling rate is an important processing factor that affects the microstructure of these alloys and then significantly influences mechanical behavior of the Sn-Ag-Cu solder joints. It is demonstrated that the amount and size of large Ag3Sn plates increase with decreasing of the cooling rate. When large Ag3Sn plates present in the solder joints at the lower cooling rate, they may affect the mechanical integrity of the joints by providing a crack initialization during the mechanical testing under room-temperature condition. In the present paper, the effects of cooling rate on the microstructure and mechanical properties are studied on Sn-3.8Ag-0.7Cu solder ball, including shear strength and ball pull test. There are two kinds of fracture mode for Ag3Sn plates preformed mechanical loading in room-temperature condition. One is brittle fracture inside Ag3Sn plate itself; the other is interfacial fracture of Ag3Sn plates and the IMC layer. Moreover, the fractures of large Ag3Sn plates induce the decrease of mechanical properties on Sn-3.8Ag-0.7Cu solder ball. The critical cooling rate of large Ag3Sn plate formation is also investigated.

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