Reliability evaluation of trimetal integrated circuits in plastic packages

1978 ◽  
Vol 17 (2) ◽  
pp. 251
1995 ◽  
Vol 54 (1-4) ◽  
pp. 199-204 ◽  
Author(s):  
O. Slattery ◽  
T. Hayes ◽  
W. Lawton ◽  
G. Kelly ◽  
C. Lyden ◽  
...  

2008 ◽  
Vol 5 (2) ◽  
pp. 44-51
Author(s):  
Isabelle Bord ◽  
Bruno Levrier ◽  
Yannick Deshayes ◽  
Laurent Béchou ◽  
Yves Ousten

Reliability assessment of components, integrated circuits, and microassemblies is clearly identified as a major factor in the on-going development of microelectronics. Since the last decade, the 3-D packaging and interconnections have emerged, and integrated packages have been developed. System-in-package (SIP) has become the principal support for integrated systems. Numerous problems are linked to their decreasing dimensions, the increasing numbers of interfaces (multichips stacked one on top of another), and plastic packages that must tolerate higher temperatures (RoHS). How is the reliability of such components assessed? What are the tools to investigate failure mechanisms in these new packages? This article gives some solutions mixing acoustic analysis, x-ray microscopy, electrical testing, and the use of specific tests points (sensors) placed in the package.


2020 ◽  
Vol 12 (4) ◽  
pp. 37-41 ◽  
Author(s):  
Vladimir Zolnikov ◽  
Svetlana Evdokimova ◽  
Ekaterina Grosheva ◽  
A. Yankov

The article considers a model for evaluating the reliability of integrated circuits (IC) depending on the temperature of the crystal and the environment. The calculation and experimental prediction of the reliability of the 1921VK028 chips was carried out, the dependences of the minimum time to failure of the product on the temperature of the 1921VK028 IC crystal and the gamma-percent life of the IC on the ambient temperature were obtained. The obtained values of these chip parameters meet the requirements of ISO 11 0998-99


Open Physics ◽  
2016 ◽  
Vol 14 (1) ◽  
pp. 166-170 ◽  
Author(s):  
Gökhan Gökdere ◽  
Mehmet Gürcan ◽  
Muhammet Burak Kılıç

AbstractIn many physical systems, reliability evaluation, such as ones encountered in telecommunications, the design of integrated circuits, microwave relay stations, oil pipeline systems, vacuum systems in accelerators, computer ring networks, and spacecraft relay stations, have had applied consecutivek-out-of-nsystem models. These systems are characterized as logical connections among the components of the systems placed in lines or circles. In literature, a great deal of attention has been paid to the study of the reliability evaluation of consecutivek-out-of-nsystems. In this paper, we propose a new method to compute the reliability of consecutivek-out-of-n:F systems, withnlinearly and circularly arranged components. The proposed method provides a simple way for determining the system failure probability. Also, we write R-Project codes based on our proposed method to compute the reliability of the linear and circular systems which have a great number of components.


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