Laser synthesis of thin films of metal silicides

1992 ◽  
Vol 218 (1-2) ◽  
pp. 95-108 ◽  
Author(s):  
E D'Anna ◽  
G Leggieri ◽  
A Luches
ChemInform ◽  
2010 ◽  
Vol 24 (13) ◽  
pp. no-no
Author(s):  
E. D'ANNA ◽  
G. LEGGIERI ◽  
A. LUCHES

2020 ◽  
pp. 110460
Author(s):  
Liubov Parshina ◽  
Oleg Novodvorsky ◽  
Olga Khramova ◽  
Dmitriy Gusev ◽  
Alexander Polyakov ◽  
...  

1988 ◽  
Vol 131 ◽  
Author(s):  
Bernard J. Aylett

ABSTRACTIt is shown that volatile molecular compounds with silicon-metal bonds can act as effective MOCVD precursors to metal silicides, which aredeposited as thin films under relatively mild conditions. Strategies for the design and synthesis of such “prevenient” precursors are explored, and possible extensions of this approach are considered.


1996 ◽  
Vol 26 (4) ◽  
pp. 375-376 ◽  
Author(s):  
P I Nikitin ◽  
M V Valeiko ◽  
A M Gorbanzade ◽  
A A Beloglazov ◽  
Vitalii I Konov
Keyword(s):  

2006 ◽  
Vol 918 ◽  
Author(s):  
Wendong Song ◽  
L.P. Shi ◽  
X.S. Miao ◽  
T.C. Chong

AbstractSn-doped Ge-Sb-Te films on Si substrates were prepared by laser synthesis at the different growth temperatures. The compositions of Sn-doped Ge-Sb-Te films were analysized by X-ray photoelectron spectroscopy. The crystal structures of Sn-doped Ge-Sb-Te thin films with a Sn content of less than 30 at% are close to Ge2Sb2Te5. The crystallization behaviors of Sn-doped Ge-Sb-Te films were analyzed by self-developed phase change temperature tester. The crystallization temperatures of Sn4.3Ge32.9Sb28.1Te34.6, Sn9.8Ge20.3Sb28.4Te41.5 and Sn18.8Ge19.5Sb25.3Te36.4 are 141.5, 137.3 and 135.0 °C at a ramp rate of 20 °C/min, respectively. Doping Sn into Ge-Sb-Te will result in a decrease of crystallization temperature. It was also found that crystallization temperature increases with an increase of ramp rate for a phase change material. The activity energy Ea and frequency factor ¦Ô for Sn9.8Ge20.3Sb28.4Te41.5 thin films are 2.42 eV and 1.7 × 1026 Hz, respectively. The crystallization speed of Sn-doped Ge-Sb-Te is estimated to be faster than Ge2Sb2Te5.


Author(s):  
L.J. Chen ◽  
L.S. Hung ◽  
J.W. Mayer

Metal silicides have found increasing use in microelectronic industry as contact materials. Energy beam annealing offers controlled energy deposition in the near surface region so that silicide growth is achieved without heating the entire layer. When pulsed laser and electron at high power density were applied to metal-semiconductor systems, cellular structures have been formed with silicon columns surrounded by silicide walls as a result of the formation of the molten layer of metal and silicon followed by segregation due to constitutional supercooling as the melt front moves toward the surface. A wealth of microstructures were observed in pulsed ion beam annealed nickel thin films on silicon. An interface melting mechanism was invoked to explain the results. In this paper, we report further data on the subject.


1987 ◽  
Vol 104 ◽  
Author(s):  
J. M. Gibson

ABSTRACTThe growth of the epitaxial silicides NiSi2 and CoSi2 on Si is discussed from observations made by in-situ transmission electron microscopy. In particular, we observe the occurrence of epitaxial metastable phases which arise from the dominance of interface energy in extremely thin films. Such phases relate to the thickness dependence of the microstructure in these silicides and may be expected to occur in many binary and more complex thin film systems.


Open Physics ◽  
2009 ◽  
Vol 7 (2) ◽  
Author(s):  
Maciej Cegiel ◽  
Maciej Bazarnik ◽  
Ryszard Czajka

AbstractContinuing miniaturization of electronic devices necessarily requires assembly of several different objects or devices in a small space. Therefore, besides thin films growth, the possibility of fabricating wires and dots [1, 2] at the nanometre scale composed of metal silicides is of the top interest. This report is about the STM/STS investigation of cobalt silicides’ nanostructures created on Si(111)-(√19 × √19) substrates via Co evaporation and post deposition annealing. This (√19 × √19) reconstruction was induced by Ni doping. Less than 1ML of Co on surface was obtained. Surface reconstruction induced growth of agglomerates of clusters rather than an uniform layer. The post deposition annealing of a crystal sample (up to 670 K, 770 K, 870 K, 970 K, 1070 K and 1170 K) led to creation of silicides’ nanostructures. Measurements showed that coalescence of Co nanoislands begun around 970 K. Annealing above 1070 K led to alloying of a Co, Ni and Si. As a consequence the Si(111)-(7×7) reconstruction occurred at the cost of Si(111)-(√19 × √19).


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