Low energy, high current density ion implantation of materials at elevated temperatures for tribological applications

1996 ◽  
Vol 83 (1-3) ◽  
pp. 218-227 ◽  
Author(s):  
R. Wei
1996 ◽  
Vol 83 (1-3) ◽  
pp. 250-256 ◽  
Author(s):  
P.J. Wilbur ◽  
J.A. Davis ◽  
R. Wei ◽  
J.J. Vajo ◽  
D.L. Williamson

1997 ◽  
Vol 473 ◽  
Author(s):  
S. Shingubara ◽  
S. Kajiwara ◽  
T. Osaka ◽  
H. Sakaue ◽  
T. Takahagi

ABSTRACTFormation and morphological change of voids induced by electromigration in polycrystalline Cu interconnects on TiN have been investigated at various current density conditions at elevated temperatures. At first voids were formed at grain boundaries, then they grew further to elongate in the electric field direction. Void elongation parameter (a ratio of void diameters in longitudinal to lateral directions to the electric field) was 2.53 when the current density was 9×106A/cm2, while it was 1.31 when the current density was 3×106A/cm2at 400°C, 50h. Occurrence of void elongation is enhanced with increase in current density, and its relationship to grain boundaries are discussed by FIB-SIM image analysis.


1997 ◽  
Vol 96 (1) ◽  
pp. 52-57 ◽  
Author(s):  
P.J. Wilbur ◽  
J.A. Davis ◽  
D.L. Williamson ◽  
J.J. Vajo ◽  
R. Wei

Author(s):  
Sanshuang Gao ◽  
Mengmeng Jin ◽  
Jiaqiang Sun ◽  
Xijun Liu ◽  
Shusheng Zhang ◽  
...  

The electrocatalytic CO2 conversion with high current density and low energy consumption are dimerous key factors for practical CO2 fixation. Herein, coralloid Au was prepared via a facile electrodeposition approach,...


2015 ◽  
Vol 86 (11) ◽  
pp. 113303 ◽  
Author(s):  
Y. Hirano ◽  
S. Kiyama ◽  
Y. Fujiwara ◽  
H. Koguchi ◽  
H. Sakakita

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