Detecting the motion of a planar surface by line and surface integrals

1984 ◽  
Vol 28 (1) ◽  
pp. 135
Author(s):  
Ken-whi Kanatani
Keyword(s):  
Planar Surface ◽  
Surface Integrals

Automated Diagonal Slice and View Solution for 3D Device Structure Analysis

2018 ◽  
Author(s):  
Sang Hoon Lee ◽  
Jeff Blackwood ◽  
Stacey Stone ◽  
Michael Schmidt ◽  
Mark Williamson ◽  
...  
Keyword(s):  
Cross Section ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Image Data ◽  
Planar Surface ◽  
Device Structure ◽  
Cross Sectional ◽  
Device Structures ◽  
The Cross ◽  
Planar Analysis

Abstract The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.

Precision Xe Plasma FIB Delayering for Physical Failure Analysis of Sub-20 nm Microprocessor Devices

2017 ◽  
Author(s):  
D. Zudhistira ◽  
V. Viswanathan ◽  
V. Narang ◽  
J.M. Chin ◽  
S. Sharang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Dielectric Films ◽  
Planar Surface ◽  
Chemical Methods ◽  
Root Cause ◽  
Essential Step ◽  
Dielectric Layers ◽  
Wet Chemical ◽  
20 Nm ◽  
Low K

Abstract Deprocessing is an essential step in the physical failure analysis of ICs. Typically, this is accomplished by techniques such as wet chemical methods, RIE, and mechanical manual polishing. Manual polishing suffers from highly non-uniform delayering particularly for sub 20nm technologies due to aggressive back-end-of-line scaling and porous ultra low-k dielectric films. Recently gas assisted Xe plasma FIB has demonstrated uniform delayering of the metal and dielectric layers, achieving a planar surface of heterogeneous materials. In this paper, the successful application of this technique to delayer sub-20 nm microprocessor chips with real defects to root cause the failure is presented.

Online three-dimensional SLAM by registration of large planar surface segments and closed-form pose-graph relaxation

2010 ◽  
Vol 27 (1) ◽  
pp. 52-84 ◽  
Author(s):  
Kaustubh Pathak ◽  
Andreas Birk ◽  
Narunas Vaskevicius ◽  
Max Pfingsthorn ◽  
Sören Schwertfeger ◽  
...  
Keyword(s):  
Closed Form ◽  
Three Dimensional ◽  
Planar Surface

Reflection due to fluorescence of a radiant energy flux impinging on a planar surface

1990 ◽  
Vol 43 (2) ◽  
pp. 173-178 ◽  
Author(s):  
A. Bourdier ◽  
J.R. Burgan ◽  
J.F. Desfond ◽  
J.J. Frey ◽  
Y. Saillard
Keyword(s):  
Energy Flux ◽  
Radiant Energy ◽  
Planar Surface ◽  
Radiant Energy Flux
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