Automated Diagonal Slice and View Solution for 3D Device Structure Analysis

The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.

Planar Analysis of Copper-Aluminium Intermetallics

This paper presents a quick, reliable, and fully quantitative method of measuring the intermetallic coverage of copper to aluminium bonding at time zero and post reliability stressing. This method is currently used in select manufacturing quality control processes, as well as during product release procedures. By applying this measurement method after various life-tests, it has been possible to collect information on degradation in the copper aluminium system which is currently being used to make a model of the corrosion mechanism in the copper aluminium system.