In situ thin films of YBa2Cu3O7 prepared by single target DC-magnetron sputtering

1989 ◽  
Vol 158 (1-2) ◽  
pp. 293-297 ◽  
Author(s):  
J.-M. Triscone ◽  
M.G. Karkut ◽  
O. Brunner ◽  
L. Antognazza ◽  
M. Decroux ◽  
...  
1998 ◽  
Vol 15 (5) ◽  
pp. 373-375 ◽  
Author(s):  
Ying-zi Zhang ◽  
Duo-gui Yang ◽  
Lin Li ◽  
Bai-ru Zhao ◽  
Shun-lian Jia ◽  
...  

1991 ◽  
Vol 13 (4) ◽  
pp. 477-483
Author(s):  
A. Andreone ◽  
A. Barone ◽  
A. Di Chiara ◽  
F. Miletto Granozio ◽  
G. Peluso ◽  
...  

1998 ◽  
Vol 511 ◽  
Author(s):  
S. H. Yoo ◽  
S. J. Heo ◽  
Y.-H. Kim ◽  
B. J. Han ◽  
J. H. Yoon

ABSTRACTThe effects of RF plasma precleaning and polyimide curing conditions on the peel strength have been studied. polyimide precursors of BG-2480 (Toray) and PI-2611 (Du Pont) were spincoated and cured under the various conditions. Cured polyimide substrates were in-situ Ar+ RF plasma cleaned prior to metal deposition. Al-2%Si or Al-0.5%Cu-1%Si thin films were deposited onto polyimide substrates using DC magnetron sputtering.The peel strength was enhanced by RF plasma treatment. The Al/modified PI specimen failed cohesively in the polyimide. The polyimide curing condition strongly affects the peel strength in the Al/modified PI system.


1988 ◽  
Vol 27 (Part 2, No. 11) ◽  
pp. L2091-L2093 ◽  
Author(s):  
Yoshinori Hakuraku ◽  
Yoshinari Aridome ◽  
Tetsuya Ogushi

2017 ◽  
Vol 4 (5) ◽  
pp. 6311-6316 ◽  
Author(s):  
Pongladda Panyajirawut ◽  
Nattha Pratumsuwan ◽  
Kornkamon Meesombad ◽  
Kridsana Thanawattana ◽  
Artit Chingsungnoen ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document