Adhesion Study in Aluminum/Polyimide System

ABSTRACTThe effects of RF plasma precleaning and polyimide curing conditions on the peel strength have been studied. polyimide precursors of BG-2480 (Toray) and PI-2611 (Du Pont) were spincoated and cured under the various conditions. Cured polyimide substrates were in-situ Ar+ RF plasma cleaned prior to metal deposition. Al-2%Si or Al-0.5%Cu-1%Si thin films were deposited onto polyimide substrates using DC magnetron sputtering.The peel strength was enhanced by RF plasma treatment. The Al/modified PI specimen failed cohesively in the polyimide. The polyimide curing condition strongly affects the peel strength in the Al/modified PI system.

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In Situ Epitaxial Growth of the Gd-Ba-Cu-O Superconducting Thin Films on (100) LaAlO3 by Dc-Magnetron Sputtering Using Single Planar Target

Science and Technology of Thin Film Superconductors 2 ◽

10.1007/978-1-4684-1345-8_14 ◽

1990 ◽

pp. 103-107

Author(s):

H. C. Li ◽

H. R. Yi ◽

R. L. Wang ◽

G. N. Zhou ◽

Y. Chen ◽

...

Keyword(s):

Thin Films ◽

Magnetron Sputtering ◽

Epitaxial Growth ◽

Superconducting Thin Films ◽

Dc Magnetron Sputtering ◽

Planar Target

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Epitaxial Growth of Bi 2 Sr 2-x La x Cu 1 O 6+δ Thin Films by In-Situ dc Magnetron Sputtering

Chinese Physics Letters ◽

10.1088/0256-307x/15/5/023 ◽

1998 ◽

Vol 15 (5) ◽

pp. 373-375 ◽

Cited By ~ 2

Author(s):

Ying-zi Zhang ◽

Duo-gui Yang ◽

Lin Li ◽

Bai-ru Zhao ◽

Shun-lian Jia ◽

...

Keyword(s):

Thin Films ◽

Magnetron Sputtering ◽

Epitaxial Growth ◽

Dc Magnetron Sputtering

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Ga doped ZnO thin films prepared by RF plasma assisted DC magnetron sputtering under reductive atmosphere without heating substrates

physica status solidi (c) ◽

10.1002/pssc.200983226 ◽

2010 ◽

Vol 7 (6) ◽

pp. 1559-1561 ◽

Cited By ~ 1

Author(s):

Toshio Hinoki ◽

Kenji Yazawa ◽

Kentaro Kinoshita ◽

Koutoku Ohmi ◽

Satoru Kishida

Keyword(s):

Thin Films ◽

Magnetron Sputtering ◽

Zno Thin Films ◽

Rf Plasma ◽

Dc Magnetron Sputtering ◽

Doped Zno ◽

Reductive Atmosphere

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High-quality MgB2 thin films in situ grown by dc magnetron sputtering

Superconductor Science and Technology ◽

10.1088/0953-2048/15/8/312 ◽

2002 ◽

Vol 15 (8) ◽

pp. 1236-1239 ◽

Cited By ~ 29

Author(s):

R Vaglio ◽

M G Maglione ◽

R Di Capua

Keyword(s):

Thin Films ◽

Magnetron Sputtering ◽

Dc Magnetron Sputtering ◽

High Quality ◽

Mgb2 Thin Films

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In situ thin films of YBa2Cu3O7 prepared by single target DC-magnetron sputtering

Physica C Superconductivity ◽

10.1016/0921-4534(89)90333-x ◽

1989 ◽

Vol 158 (1-2) ◽

pp. 293-297 ◽

Cited By ~ 37

Author(s):

J.-M. Triscone ◽

M.G. Karkut ◽

O. Brunner ◽

L. Antognazza ◽

M. Decroux ◽

...

Keyword(s):

Thin Films ◽

Magnetron Sputtering ◽

Dc Magnetron Sputtering ◽

Single Target

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In-situ and ex-situ studies of molybdenum thin films deposited by rf and dc magnetron sputtering

2010 35th IEEE Photovoltaic Specialists Conference ◽

10.1109/pvsc.2010.5614087 ◽

2010 ◽

Author(s):

H. Khatri ◽

R.W. Collins ◽

S. Marsillac

Keyword(s):

Thin Films ◽

Magnetron Sputtering ◽

Ex Situ ◽

Dc Magnetron Sputtering

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Effects of Mechanical Properties of Metal Films on The Adhesion Strength of Cr/Polyimide Interfaces

MRS Proceedings ◽

10.1557/proc-436-121 ◽

1996 ◽

Vol 436 ◽

Author(s):

Jin Won Choi ◽

Tae Sung Oh

Keyword(s):

Thin Films ◽

Mechanical Properties ◽

Yield Strength ◽

Peel Strength ◽

Metal Films ◽

Rf Plasma ◽

Lower Yield ◽

Lower Yield Strength ◽

Sputter Deposited

AbstractEffects of mechanical properties of Cu/Cr metal films on the peel strength of Cr/PI interfaces have been studied. Cr and Cu thin films were successively sputter-deposited on in-situ RF plasma-treated polyimides, and 20 μm-thick Cu was electroplated. With increasing the yield strength of Cu/Cr films from 156 MPa to 325 MPa, peel strength of Cr/PMDA-ODA and Cr/BPDA-PDA were lowered from 75 g/mam to 57 g/mm and from 69 g/mm to 20 g/mm, respectively. With identical Cu/Cr metal films, lower peel strength was obtained on Cr/BPDA-PDA interfaces, compared to the values of Cr/PMDA-ODA. Peel strength was also decreased more pronouncedly on Cr/BPDA-PDA with increasing the yield strength of Cu/Cr metal films. With T/H (80°C/94% R.H.) exposure, however, peel strength was lowered much more pronouncedly on Cr/PMDA-ODA than on Cr/BPDA-PDA, especially for specimens with Cu/Cr metal films of lower yield strength.

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