In Situ Epitaxial Growth of the Gd-Ba-Cu-O Superconducting Thin Films on (100) LaAlO3 by Dc-Magnetron Sputtering Using Single Planar Target

Author(s):  
H. C. Li ◽  
H. R. Yi ◽  
R. L. Wang ◽  
G. N. Zhou ◽  
Y. Chen ◽  
...  
1998 ◽  
Vol 15 (5) ◽  
pp. 373-375 ◽  
Author(s):  
Ying-zi Zhang ◽  
Duo-gui Yang ◽  
Lin Li ◽  
Bai-ru Zhao ◽  
Shun-lian Jia ◽  
...  

Author(s):  
B. Riah ◽  
Julien Camus ◽  
Abdelhak Ayad ◽  
Mohammad Rammal ◽  
Raouia Zernadji ◽  
...  

This paper reports the effect of silicon substrate orientation and aluminum nitride buffer layer deposited by molecular beam epitaxy on the growth of aluminum nitride thin films deposited by DC magnetron sputtering technique at low temperature. The structural analysis has revealed a strong (0001) fiber texture for both substrates Si (100) and (111) and a hetero-epitaxial growth on few nanometers AlN buffer layer grown by MBE on Si (111) substrate. SEM images and XRD characterization have shown an enhancement in AlN crystallinity thanks to AlN (MBE) buffer layer. Raman spectroscopy indicated that the AlN film was relaxed when it deposited on Si (111), in compression on Si (100) and under tension on AlN buffer layer grown by MBE/Si (111) substrates, respectively. The interface between Si (111) and AlN grown by MBE is abrupt and well defined; contrary to the interface between AlN deposited using PVD and AlN grown by MBE. Nevertheless, AlN hetero-epitaxial growth was obtained at low temperature (<250°C).


1987 ◽  
Vol 64 (5) ◽  
pp. 749-751 ◽  
Author(s):  
D.S. Burbidge ◽  
S.K. Dew ◽  
B.T. Sullivan ◽  
N. Fortier ◽  
R.R. Parsons ◽  
...  

1988 ◽  
Vol 52 (23) ◽  
pp. 1992-1994 ◽  
Author(s):  
Brian T. Sullivan ◽  
N. R. Osborne ◽  
W. N. Hardy ◽  
J. F. Carolan ◽  
B. X. Yang ◽  
...  

1995 ◽  
Vol 34 (Part 1, No. 10) ◽  
pp. 5579-5584 ◽  
Author(s):  
Shin-ichi Karimoto ◽  
Keiichi Tanabe ◽  
Shugo Kubo ◽  
Koji Tsuru ◽  
Minoru Suzuki

1998 ◽  
Vol 511 ◽  
Author(s):  
S. H. Yoo ◽  
S. J. Heo ◽  
Y.-H. Kim ◽  
B. J. Han ◽  
J. H. Yoon

ABSTRACTThe effects of RF plasma precleaning and polyimide curing conditions on the peel strength have been studied. polyimide precursors of BG-2480 (Toray) and PI-2611 (Du Pont) were spincoated and cured under the various conditions. Cured polyimide substrates were in-situ Ar+ RF plasma cleaned prior to metal deposition. Al-2%Si or Al-0.5%Cu-1%Si thin films were deposited onto polyimide substrates using DC magnetron sputtering.The peel strength was enhanced by RF plasma treatment. The Al/modified PI specimen failed cohesively in the polyimide. The polyimide curing condition strongly affects the peel strength in the Al/modified PI system.


1988 ◽  
Vol 27 (Part 2, No. 11) ◽  
pp. L2091-L2093 ◽  
Author(s):  
Yoshinori Hakuraku ◽  
Yoshinari Aridome ◽  
Tetsuya Ogushi

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