Indentation hardness and fracture toughness in single crystal TiC0.96

1996 ◽  
Vol 209 (1-2) ◽  
pp. 329-336 ◽  
Author(s):  
C. Maerky ◽  
M.-O. Guillou ◽  
J.L. Henshall ◽  
R.M. Hooper
2008 ◽  
Vol 392-394 ◽  
pp. 267-270
Author(s):  
Qiang Liu ◽  
Ying Xue Yao ◽  
L. Zhou

Nanoindentation device has the ability to make the load-displacement measurement with sub-nanometer indentation depth sensitivity, and the nanohardness of the material can be achieved by the load-displacement curve. Aiming at the influence law of indenter tip radius to indentation hardness, testing on the hardness of single-crystal silicon were carried out with the new self-designed nanohardness test device based on nanoindentation technique. Two kinds of Berkovich indenter with radius 40nm and 60nm separately were used in this experiment. According to the load-depth curve, the hardness of single-crystal silicon was achieved by Oliver-Pharr method. Experimental results are presented which show that indenter tip radius do influence the hardness, the hardness value increases and the indentation size effect (ISE) becomes obvious with the increasing of tip radius under same indentation depth.


1981 ◽  
Vol 7 ◽  
Author(s):  
C. J. Mchargue ◽  
H. Naramoto ◽  
B. R. Appleton ◽  
C. W. White ◽  
J. M. Williams

ABSTRACTSingle crystals of Al2O3 were implanted with chromium and zirconium to fluences of 1 × 1016 to 1 × 1017 ions cm−2. Rutherford backscattering-channeling studies showed the surface layers to be damaged but crystalline with the implanted ions randomly distributed. The microhardness and indentation fracture toughness were higher for the random solutions than for conventionally formed solid solutions. Changes in structure and properties caused by annealing in air at temperatures up to 1800°C were studied.


1993 ◽  
Vol 28 (11) ◽  
pp. 1383-1385 ◽  
Author(s):  
T. Mah ◽  
T.A. Parthasarathy

MRS Advances ◽  
2017 ◽  
Vol 2 (26) ◽  
pp. 1405-1410
Author(s):  
Nobuhiro Matsuzaki ◽  
Ken-ichi Ikeda ◽  
Seiji Miura ◽  
Nobuaki Sekido ◽  
Takahito Ohmura

ABSTRACTAl3Nb is known as a high oxidation resistant material, while it is quite brittle. As the fracture toughness of Al3Nb single crystal and its dependence on the composition are not obtained, the micro-sized fracture testing proposed by Suzuki et al. was performed. Al3Nb single crystal micron-order size cantilevers with a chevron-notch were fabricated in a grain of two-phase polycrystalline alloys by using FIB (Focused Ion Beam). From the load-displacement curves during the bending by a nanoindenter, the average value of fracture toughness of Nb-rich Al3Nb is evaluated to be 2.90 MPam1/2, while the fracture toughness of Al-rich Al3Nb is also evaluated to be 2.82 MPam1/2. From this result, the fracture toughness of Al3Nb is less dependent on its Al/Nb ratio. Furthermore the fracture toughness of Al3 (Nb, V) was evaluated to be 2.82 MPam1/2.The fracture toughness of Al3Nb is seemingly insensitive to V addition.


Author(s):  
James F. Dill ◽  
Michael N. Gardos ◽  
Robert G. Hardisty

This paper describes the results of studies of the machining performance and the indentation hardness and fracture toughness of different silicon nitride materials as part of an effort to better define the optimum machining conditions for bearing components. This work builds on prior efforts by two of the authors, Gardos and Hardisty (1993) who formulated a simple relationship between diamond grinding performance of silicon nitride bearing balls and a wear equation first detailed by Evans and Wilshaw (1976). The goal of this present work was to determine the general applicability of such a relationship, i.e. could simple indentation studies be used to define finishing conditions for different silicon nitride materials. The availability of such a simple test would reduce the time required for developing an acceptable process when a supplier changes his formulation, or when a new material becomes available. Quicker development of optimum finishing conditions would eventually result in a lower-cost product for users. The initial study by Gardos and Hardisty (1993) was based on limited data taken at a fixed set of conditions. This study expanded the range of conditions evaluated and the number of ceramic materials studied in an effort to define the universality of the relationship between grinding wear, hardness and toughness. This study has shown that no simple relationship like that first envisioned by the authors exists. The results showed that the grinding wear of the individual silicon nitride materials increased at different rates as a function of load. Because of the differences found in the load dependence of grinding rates, no simple relationship between hardness, fracture toughness and grinding rate could be found which fit the data over the range of conditions studied. This work is part of an ARPA funded effort to provide a tribological performance database on ceramic bearing materials, including their grinding and finishing properties, and their interaction with standard bearing steels.


1977 ◽  
Vol 60 (7-8) ◽  
pp. 373-375 ◽  
Author(s):  
J. L. HENSHALL ◽  
D. J. ROWCLIFFE ◽  
J. W. EDINGTON

2005 ◽  
Vol 297-300 ◽  
pp. 292-298 ◽  
Author(s):  
Satoru Koyama ◽  
Kazuki Takashima ◽  
Yakichi Higo

Reliability is one of the most critical issues for designing practical MEMS devices. In particular, the fracture toughness of micro-sized MEMS elements is important, as micro/nano-sized flaws can act as a crack initiation sites to cause failure of such devices. Existing MEMS devices commonly use single crystal silicon. Fracture toughness testing upon micro-sized single crystal silicon was therefore carried out to examine whether a fracture toughness measurement technique, based upon the ASTM standard, is applicable to 1/1000th sized silicon specimens. Notched cantilever beam type specimens were prepared by focused ion beam machining. Two specimens types with different notch orientations were prepared. The notch plane/direction were (100)/[010], and (110)/[ _ ,110], respectively. Fracture toughness tests were carried out using a mechanical testing machine for micro-sized specimens. Fracture has been seen to occur in a brittle manner in both orientations. The provisional fracture toughness values (KQ) are 1.05MPam1/2 and 0.96MPam1/2, respectively. These values meet the micro-yielding criteria for plane strain fracture toughness values (KIC). Fracture toughness values for the orientations tested are of the same order as values in the literature. The results obtained in this investigation indicate that the fracture toughness measurement method used is applicable for micro-sized components of single crystal silicon in MEMS devices.


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