Experimental characterization of the local strain field in a heterogeneous elastoplastic material

1994 ◽  
Vol 42 (11) ◽  
pp. 3865-3880 ◽  
Author(s):  
L. Allais ◽  
M. Bornert ◽  
T. Bretheau ◽  
D. Caldemaison
Keyword(s):  
Strain Field ◽  
Local Strain ◽  
Elastoplastic Material ◽  
Experimental Characterization

scholarly journals Experimental characterization of the intragranular strain field in columnar ice during transient creep

2012 ◽  
Vol 60 (8) ◽  
pp. 3655-3666 ◽  
Author(s):  
F. Grennerat ◽  
M. Montagnat ◽  
O. Castelnau ◽  
P. Vacher ◽  
H. Moulinec ◽  
...  
Keyword(s):  
Strain Field ◽  
Transient Creep ◽  
Experimental Characterization

Experimental Characterization of the Mechanical Behavior of Concrete Bars in the Tensile Test

2012 ◽  
Vol 498 ◽  
pp. 97-102
Author(s):  
B. Hortigón ◽  
E.J. Nieto ◽  
F.F. Ancio ◽  
O. Hernández
Keyword(s):  
Tensile Test ◽  
Experimental Analysis ◽  
Finite Deformation ◽  
Strain Field ◽  
Strain Analysis ◽  
Stress And Strain ◽  
Plastic Behavior ◽  
Experimental Characterization ◽  
Flow Evolution

Necking process stress and strain analysis, which is key to determine the plastic flow evolution in finite deformation, has been widely studied and applied to a number of materials based on the theories established by Davidenkov-Spiridnova and Bridgman in the 40s decade. These theories envolve from the study of necking geometry in fracture. In this paper, we develop an exhaustive experimental analysis of the stress and strain field in the necking process, applied to concrete bars and mechanized samples with similar features, in order to compare the results with the ones given by the theories listed above and to look for the corrugation influence in the materials plastic behavior.

Strain analysis with nanometer resolution using a conventional transmission electron microsopy technique: electron diffraction contrast imaging revisited

1995 ◽  
Vol 53 ◽  
pp. 168-169
Author(s):  
Koenraad G F Janssens ◽  
Omer Van der Biest ◽  
Jan Vanhellemont ◽  
Herman E Maes ◽  
Robert Hull
Keyword(s):  
Electron Diffraction ◽  
Strain Field ◽  
Elastic Strain ◽  
Strain Analysis ◽  
Local Strain ◽  
Contrast Imaging ◽  
Strain Characterization ◽  
Physical Mechanisms ◽  
Diffraction Contrast ◽  
Transmission Electron

There is a growing need for elastic strain characterization techniques with submicrometer resolution in several engineering technologies. In advanced material science and engineering the quantitative knowledge of elastic strain, e.g. at small particles or fibers in reinforced composite materials, can lead to a better understanding of the underlying physical mechanisms and thus to an optimization of material production processes. In advanced semiconductor processing and technology, the current size of micro-electronic devices requires an increasing effort in the analysis and characterization of localized strain. More than 30 years have passed since electron diffraction contrast imaging (EDCI) was used for the first time to analyse the local strain field in and around small coherent precipitates1. In later stages the same technique was used to identify straight dislocations by simulating the EDCI contrast resulting from the strain field of a dislocation and comparing it with experimental observations. Since then the technique was developed further by a small number of researchers, most of whom programmed their own dedicated algorithms to solve the problem of EDCI image simulation for the particular problem they were studying at the time.

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Experimental Characterization of Mechanical Behavior of Cord-Rubber Composites

1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert
Keyword(s):  
Response Characteristic ◽  
Cord Compression ◽  
Complete Characterization ◽  
Strain Response ◽  
Strain Gages ◽  
Experimental Characterization ◽  
Rubber Composites ◽  
Stress Strain ◽  
Strain Data

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.

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