scholarly journals Dislocation slip transmission through a coherent Σ3{111} copper twin boundary: Strain rate sensitivity, activation volume and strength distribution function

2018 ◽  
Vol 161 ◽  
pp. 412-419 ◽  
Author(s):  
N.V. Malyar ◽  
B. Grabowski ◽  
G. Dehm ◽  
C. Kirchlechner
Keyword(s):  
Distribution Function ◽  
Strain Rate ◽  
Twin Boundary ◽  
Strain Rate Sensitivity ◽  
Activation Volume ◽  
Rate Sensitivity ◽  
Strength Distribution ◽  
Dislocation Slip ◽  
Slip Transmission

Activation volume and strain rate sensitivity in plastic deformation of nanocrystalline Ti

2013 ◽  
Vol 228 ◽  
pp. S254-S256 ◽  
Author(s):  
F. Wang ◽  
B. Li ◽  
T.T. Gao ◽  
P. Huang ◽  
K.W. Xu ◽  
...  
Keyword(s):  
Plastic Deformation ◽  
Strain Rate ◽  
Strain Rate Sensitivity ◽  
Activation Volume ◽  
Rate Sensitivity

Slip Induced Strain Rate Sensitivity for Superplastic Material?

2012 ◽  
Vol 735 ◽  
pp. 31-36 ◽  
Author(s):  
Hector Basoalto ◽  
Paul L. Blackwell
Keyword(s):  
Grain Boundary ◽  
Strain Rate ◽  
Strain Rate Sensitivity ◽  
Rate Sensitivity ◽  
Grain Boundary Sliding ◽  
Dislocation Slip ◽  
Microstructural Parameters ◽  
Sliding Mechanism ◽  
Physically Based ◽  
Boundary Sliding

The conventional consensus has it that the magnitude of the strain rate sensitivity observed in superplastic materials is linked with grain boundary sliding. The grain boundary sliding mechanism is thought to theoretically produce a strain rate sensitivity exponent of 0.5, which is in good agreement with experimental data. The present paper argues that a rate sensitivity of 0.5 can be generated by dislocation slip under certain temperature and strain rate regimes that overlap with conditions representative of superplasticity. A physically based slip model that links the relevant microstructural parameters to the macroscopic strain rate is proposed.

Strain rate sensitivity and deformation activation volume of coarse-grained and ultrafine-grained TiNi alloys

2015 ◽  
Vol 102 ◽  
pp. 99-102 ◽  
Author(s):  
D.V. Gunderov ◽  
G. Maksutova ◽  
A. Churakova ◽  
A. Lukyanov ◽  
A. Kreitcberg ◽  
...  
Keyword(s):  
Strain Rate ◽  
Strain Rate Sensitivity ◽  
Activation Volume ◽  
Rate Sensitivity ◽  
Coarse Grained ◽  
Ultrafine Grained

scholarly journals Print Velocity Effects on Strain-Rate Sensitivity of Acrylonitrile-Butadiene-Styrene Using Material Extrusion Additive Manufacturing

Polymers ◽  
2021 ◽  
Vol 13 (1) ◽  
pp. 149
Author(s):  
Wilco M. H. Verbeeten ◽  
Rob J. Arnold-Bik ◽  
Miriam Lorenzo-Bañuelos
Keyword(s):  
Mechanical Properties ◽  
Additive Manufacturing ◽  
Strain Rate ◽  
Yield Stress ◽  
Strain Rate Sensitivity ◽  
Molecular Orientation ◽  
Activation Volume ◽  
Rate Sensitivity ◽  
Acrylonitrile Butadiene Styrene ◽  
Butadiene Styrene

The strain-rate sensitivity of the yield stress for Acrylonitrile-Butadiene-Styrene (ABS) tensile samples processed via material extrusion additive manufacturing (ME-AM) was investigated. Such specimens show molecular orientation and interstitial voids that affect the mechanical properties. Apparent densities were measured to compensate for the interstitial voids. Three different printing speeds were used to generate ME-AM tensile test samples with different molecular orientation. Printing velocities influenced molecular orientation and stretch, as determined from thermal shrinkage measurements. Likewise, infill velocity affected the strain-rate dependence of the yield stress. The ABS material manifests thermorheollogically simple behavior that can correctly be described by an Eyring flow rule. The changing activation volume, as a result of a varying print velocity, scales linearly with the molecular orientation, as captured in an estimated processing-induced pre-strain. Therefore, it is suggested that ME-AM processed ABS shows a deformation-dependent activation volume. This paper can be seen as initial work that can help to improve quantitative predictive numerical tools for ME-AM, taking into account the effects that the processing step has on the mechanical properties.

Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

2010 ◽  
Vol 654-656 ◽  
pp. 2446-2449
Author(s):  
Hideaki Tsukamoto ◽  
Zhi Gang Dong ◽  
Han Huang ◽  
Tetsura Nishimura ◽  
Kazuhiro Nogita
Keyword(s):  
Strain Rate ◽  
Strain Rate Sensitivity ◽  
Structural Integrity ◽  
Activation Volume ◽  
Mechanical Performance ◽  
Rate Sensitivity ◽  
Cu Substrate ◽  
Substrate Interface ◽  
Free Solder

The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/ Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062x10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.

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