An efficient variable-node XFEM for modeling multiple crack growth: A Matlab object-oriented implementation

2020 ◽  
Vol 140 ◽  
pp. 102750 ◽  
Author(s):  
Junlei Ding ◽  
Tiantang Yu ◽  
Yin Yang ◽  
Tinh Quoc Bui
Keyword(s):  
Crack Growth ◽  
Object Oriented ◽  
Multiple Crack ◽  
Variable Node

Interactive effect of multiple crack growth on fatigue

1995 ◽  
Vol 23 (3) ◽  
pp. 219-233 ◽  
Author(s):  
A. Martín-Meizoso ◽  
J.M. Martínez-Esnaola ◽  
M. Fuentes-Pérez
Keyword(s):  
Crack Growth ◽  
Interactive Effect ◽  
Multiple Crack

Numerical Simulation of Fatigue Crack Growth for Curved Cracks Emanating from Fastener Holes in Sheets by the MVCCI Method

2006 ◽  
Vol 324-325 ◽  
pp. 863-866
Author(s):  
Holger Theilig ◽  
M. Goth ◽  
Michael Wünsche
Keyword(s):  
Numerical Simulation ◽  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Plane Stress ◽  
Mixed Mode ◽  
Mixed Mode Loading ◽  
Multiple Crack ◽  
2D Structure ◽  
Predictor Corrector

The paper presents the results of a continued study of curved fatigue crack growth in a multiple arbitrarily pre-cracked isotropic sheet under plane stress loading. The predictor-corrector method (PCM) was extended in order to analyse the growth of multiple crack systems in a finite 2D structure. Together with the recently proposed improved modified virtual crack closure integral (MVCCI) method we can obtain accurate SIF values also for interacting cracks, and furthermore we can simulate fatigue crack growth of multiple crack systems in plane sheets under proportional mixed mode loading conditions. As a result, the program PCCS-2D is written to run within ANSYS to simulate interacting curved cracks. In order to check the accuracy and efficiency of the proposed method several example problems are solved. Especially curved cracks emanating from loaded fastener holes in sheets are analysed.

Simulation of cohesive crack growth by a variable-node XFEM

2019 ◽  
Vol 14 (1) ◽  
pp. 215-228 ◽  
Author(s):  
Weihua Fang ◽  
Jiangfei Wu ◽  
Tiantang Yu ◽  
Thanh-Tung Nguyen ◽  
Tinh Quoc Bui
Keyword(s):  
Crack Growth ◽  
Cohesive Crack ◽  
Variable Node

A method for multiple crack growth in brittle materials without remeshing

2004 ◽  
Vol 61 (10) ◽  
pp. 1741-1770 ◽  
Author(s):  
É. Budyn ◽  
G. Zi ◽  
N. Moës ◽  
T. Belytschko
Keyword(s):  
Crack Growth ◽  
Brittle Materials ◽  
Multiple Crack

scholarly journals Electrical Characterization of a Double-Layered Conductive Pattern with Different Crack Configurations for Durable E-Textiles

Micromachines ◽  
2020 ◽  
Vol 11 (11) ◽  
pp. 977
Author(s):  
Tomoya Koshi ◽  
Ken-ichi Nomura ◽  
Manabu Yoshida
Keyword(s):  
Crack Growth ◽  
Tensile Deformation ◽  
Elongation Rate ◽  
Double Layers ◽  
Single Crack ◽  
Multiple Crack ◽  
Resistance Change ◽  
Change Rate ◽  
Electrical Failure ◽  
Silver Ink

For the conductive patterns of electronic textiles (e-textiles), it is still challenging to maintain low electrical resistance, even under large or cyclic tensile deformation. This study investigated a double-layered pattern with different crack configurations as a possible solution. Patterns with single crack growth exhibit a low initial resistance and resistance change rate. In contrast, patterns with multiple crack growth maintain their conductivity under deformation, where electrical failure occurs in those with single crack growth. We considered that a double-layered structure could combine the electrical characteristics of patterns with single and multiple crack growths. In this study, each layer was theoretically designed to control the crack configuration. Then, meandering copper patterns, silver ink patterns, and their double layers were fabricated on textiles as patterns with single and multiple crack growths and double-layered patterns, respectively. Their resistance changes under the single (large) and cyclic tensile deformations were characterized. The results confirmed that the double-layered patterns maintained the lowest resistance at the high elongation rate and cycle. The resistance change rates of the meandering copper and silver ink patterns were constant, and changed monotonically against the elongation rate/cycle, respectively. In contrast, the change rate of the double-layered patterns varied considerably when electrical failure occurred in the copper layer. The change rate after the failure was much higher than that before the failure, and on the same order as that of the silver ink patterns.

Multiple Crack Growth and Coalescence in Meshfree Methods with Adistance Function-Based Enriched Kernel

2013 ◽  
Vol 560 ◽  
pp. 37-60 ◽  
Author(s):  
E. Barbier ◽  
Nik Petrinic
Keyword(s):  
Crack Growth ◽  
Finite Length ◽  
Minimum Distance ◽  
Meshfree Methods ◽  
Weight Functions ◽  
Generic Point ◽  
Multiple Crack ◽  
End Points ◽  
Distance Fields ◽  
Derivatives Of

Distance fields are functions defining the minimum distance between any generic point inspace and the boundaries of an object. This paper shows some important properties of these fields andtheir derivatives. In fact, for polygonal lines, the derivatives of distance fields are discontinuous overthe finite length of the segment, but continuous all around the end-points. An immediate consequenceis their application as intrinsic enrichment of weight functions in meshless methods, for the treatmentof multiple arbitrary cracks. By introducing such explicitly known function for the distance fields,discontinuities can be easily incorporated in the kernel in a simple, multiplicative manner. The result-ing method allows a more straightforward implementation and simulation of the presence of multiplecracks in a meshless framework without using any of the existing algorithms such as visibility, trans-parency and diffraction. Furthermore, one of the main advantages of this approach is the automaticcoalescence of multiple interacting cracks, i.e. no particular enrichment functions are necessary at thejunction points.

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