Loop Heat Pipes (LHPs) are used in many thermal management applications, especially for micro-electronics cooling, because of their ability to passively transport thermal energy from a source to a sink. This paper describes the development of a parametric model for a non-conventional LHP operating in steady state, employed to cool Light Emitting Diodes (LEDs). This device is comprised of a flat evaporator, and a finned circular loop wherein condensation and sub-cooling of the working fluid takes place. Unlike a conventional LHP, this device has no compensation chamber. In the mesh screen of the evaporator, the vapor flow entrains liquid and hence the quality of the two-phase mixture leaving the evaporator (xevap) is less than unity (unlike in a conventional LHP where saturated vapor leaves the evaporator). Since this lower quality (approximately 0.2) results in a smaller ratio of latent energy to sensible energy being removed by the condenser and sub-cooler respectively; the ratio of the length of the sub-cooler to condenser length is significantly larger. This results in more stable and controlled operation of the device. Mathematical models of the evaporator, the condenser and the sub-cooler sections are developed, and two closure conditions are employed in this model. For consistency and accuracy, some parameters in the model, such as the natural convection heat transfer coefficient (h o) and a few thermal resistances in the evaporator, are estimated empirically from test data on the device. The empirically obtained value of the heat transfer coefficient is in very good agreement with correlations from the literature. The parametric model accurately predicts the LED board temperature and other temperatures for a specific amount of thermal energy dissipated by the LEDs.
Steady State Performance Characteristics of a Single Pad Externally Adjustable Fluid Film Bearing
