Effect of interstitial compounds in controlling thermal contact conductance across pressed joints at cryogenic temperature and low contact pressure

Author(s):  
Reji Joseph ◽  
N Asok Kumar ◽  
S Sunil Kumar
Author(s):  
D Tang ◽  
D Li ◽  
Y Peng ◽  
Z Du

The thermal contact conductance (TCC) is one of the principal parameter in heat transfer mechanism of tube—fin heat exchangers. Because of the difficulties in experimental measurements, the tube—fin TCC has not been focused deeply. This article presents a novel method in evaluating the TCC of tube—fin heatexchanger. First, the tube—fin contact status is investigated with a finite-element model of tube expansion process. Distribution of contact pressure along the tube—fin interface is obtained from the simulation results. Then, experiments are carried out for the relationship between the contact pressure and the TCC. Combining the experiment result with the contact pressure distribution, the tube—fin TCC can be evaluated. Based on the method, effect of processing factors of the expansion forming process, such as expanding ratio and die geometry, are examined.


Author(s):  
He Peng ◽  
Ning Xu ◽  
Zhansheng Liu

Tighten force has much influence on tie-bolt fastened rotor dynamics. Temperature distribution in tie-bolt fastened rotor results in thermal expansion of rotor and rods. The difference of thermal expansion between rotor and rods causes the variation of bolt load. With considering the thermal contact conductance, the thermal model of tie-bolt fastened rotor was established by finite element method and the axial temperature distribution was obtained. The influences of surface roughness, nominal contact pressure and axial position of contact on axial temperature distribution were analysed. Based on temperature distribution in the tie-bolt fastened rotor, the variation of tighten force was investigated. Results show that nominal contact pressure, surface roughness and axial contact arrange have different influences on the variation of tighten force with temperature.


2020 ◽  
Vol 50 ◽  
pp. 418-424 ◽  
Author(s):  
Joonas Ilmola ◽  
Aarne Pohjonen ◽  
Oskari Seppälä ◽  
Jari Larkiola

2006 ◽  
Vol 129 (7) ◽  
pp. 907-911 ◽  
Author(s):  
Chakravarti Madhusudana ◽  
Wui-wai Cheng

The thermal contact conductance (TCC) at the mechanically bonded tube/fin interface of a heat exchanger may be controlled by varying the amount of initial expansion of the tube. However, in this case, the TCC also varies with the temperature because of the differential expansion between the tube and the fin. The objectives of the present study are to determine the improvement in TCC resulting from higher degrees of the tube expansion, to determine the variation in TCC with the maximum temperature, and to estimate the change in contact pressure with the temperature. This paper presents the results of heat transfer experiments on mechanically expanded finned-tube specimens. Experiments were conducted in an atmosphere of nitrogen. The results showed that the TCC is enhanced by increasing the degree of initial expansion. There is a practical limit, however, to the maximum expansion that can be attempted. For the direction of heat flow prevailing in the experiments, the TCC and the contact pressure of every specimen decreased with increasing temperature.


2020 ◽  
Vol 15 ◽  

For the optimization of the annealing process of aluminium coils, simulation of the process is often performed. To simulate the process with higher accuracy, reliable input parameters are required and the thermal conductivity (thermal contact conductance) is one of them. In the present study, the thermal conductivity and thermal contact conductance of AA3003 alloy sheets were measured by a steady state comparative longitudinal heat flow method at different contact pressure. To evaluate the thermal conductance at the interface, thermal resistance network model' was applied. In addition, the surface roughness of the sheets was also investigated. Based on the measurement results, the semi-empirical equation for the relationship between thermal contact conductance and contact pressure was obtained


1990 ◽  
Vol 112 (4) ◽  
pp. 350-356 ◽  
Author(s):  
V. K. Maudgal ◽  
J. Kliman ◽  
J. Miles ◽  
J. E. Sunderland

This study examines experimentally the quality of contact of mechanical joints in a diode heat sink assembly. Steady-state contact conductance, h, is used as a quantitative measure of the quality of contact of a joint. The emphasis of the work is on determining the contact conductance, h, for a nonideal joint using a noncontact method of recording temperature distribution in a complex geometry. Thermal contact conductance for an interface is known to depend on parameters such as contact pressure, mean interface temperature and the surface roughness characteristics of the mating surfaces. The results are presented for three different conditions of the interface namely (i) the mating surfaces are bare (ii) aluminum foil is inserted between the mating surfaces, and (iii) a high thermal conductivity grease is applied to the mating surfaces. Two levels of contact pressure are used for the interface with aluminum foil. The results indicate that the contact conductance increases with the mean temperature of the interface in all the cases. At low interface temperature, the contact conductance was greatest for the bare interface conditions. At high interface temperature, the contact conductance was greatest for the aluminum foil interface condition.


2005 ◽  
Vol 127 (6) ◽  
pp. 657-659 ◽  
Author(s):  
Bapurao Kshirsagar, ◽  
Prashant Misra, ◽  
Nagaraju Jampana, and ◽  
M. V. Krishna Murthy

The thermal contact conductance studies across gold-coated oxygen-free high-conductivity copper contacts have been conducted at different contact pressures in vacuum, nitrogen, and helium environments. It is observed that the thermal contact conductance increases not only with the increase in contact pressure but also with the increase in thermal conductivity of interstitial medium. The experimental data are found to be in good agreement with the literature.


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