Comparison of synthesis and spark plasma sintering of YAG nano particles by variation of pH and precipitator agent

2018 ◽  
Vol 44 (18) ◽  
pp. 23215-23225 ◽  
Author(s):  
Mahsa Rahmani ◽  
Omid Mirzaee ◽  
Mohammad Tajally ◽  
Mohammad Reza Loghman-Estarki
2020 ◽  
Vol 405 ◽  
pp. 391-395
Author(s):  
Juraj Szabo ◽  
Katarína Ďurišinová ◽  
Ondrej Milkovič ◽  
Juraj Ďurišin

Dispersion strengthened Cu composites are studied over recent years to find an optimum processing route to obtain a high strength, thermal-stable copper alloy designed for modern applications in electrical engineering. The experimental Cu–4Al2O3–1MgO material was prepared by in situ thermo-chemical technique and mechanical milling followed by spark plasma sintering (SPS). The study analyses the influence of the Al2O3 and MgO secondary phases on strengthening the copper matrix. Microstructure of the composite was studied by X-ray diffraction analysis, scanning and transmission electron microscopy. The sintered microstructure shows a grain size distribution characterized by ultrafine grains/twins embedded inside the matrix of nanocrystalline grains. The microstructure is thermal stable up to 900 °C due to the dispersed alumina nano-particles that effectively strengthen crystallite/grain boundaries during the SPS process and annealing of the sintered compact at elevated temperatures. On the other hand, the coarsened MgO particles are responsible for ultrafine grains/twins formation. The obtained microstructure is important for practical utilization of the material because this structure is characterized by a good combination of strength and ductility.


2020 ◽  
Vol 54 (19) ◽  
pp. 2599-2609
Author(s):  
Abtin Heydarian ◽  
Seyed Abdolkarim Sajjadi ◽  
Mats Johnsson

In this study, the effect of SiC particle size on the sintering behavior of SiC-Si nano composites fabricated by spark plasma sintering (SPS) technique was investigated and a model was proposed, accordingly. To this purpose, SiC powders with three different particle sizes of 25 µm, 80 nm and 45 nm were chosen. It was expected that hardness of the composites increase with decreasing the SiC particle size; however, the outcomes were interesting and unpredictable. The composite with 80 nm SiC particles indicated the highest hardness. Hardness of the specimen with 25 µm SiC was low because of the large particle size of its reinforcement. While 80 and 45 nm SiC particles are considered as nano particles, the composite with 45 nm SiC particles showed lower hardness due to the growth of SiC powders during sintering according to a proposed model. Two reasons for the growth of 45 nm SiC particles were defined: (i) the fineness of the SiC particles prevented the Si particles to act as a binder between them thus, they agglomerated; (ii) SiC powders were oxidized during mixing procedure and a layer of SiO2 was formed on their surfaces. During sintering procedure, the reaction between SiC and SiO2 was happened and as a result SiO was formed. It caused vapor transportation during sintering leading to necking between particles and in turn, grain growth.


2003 ◽  
Vol 247 ◽  
pp. 71-74
Author(s):  
Moegi Iguchi ◽  
Junichi Tatami ◽  
Mikinori Hotta ◽  
Cheng Zhang ◽  
Katsutoshi Komeya ◽  
...  

2011 ◽  
Vol 49 (01) ◽  
pp. 40-45 ◽  
Author(s):  
Hyun-Kuk Park ◽  
Seung-Min Lee ◽  
Hee-Jun Youn ◽  
Ki-Sang Bang ◽  
Ik-Hyun Oh

2017 ◽  
Vol 59 (11-12) ◽  
pp. 1033-1036 ◽  
Author(s):  
Sherzod Kurbanbekov ◽  
Mazhyn Skakov ◽  
Viktor Baklanov ◽  
Batyrzhan Karakozov

2012 ◽  
Vol 27 (9) ◽  
pp. 961-964 ◽  
Author(s):  
Zhi-Qiang MA ◽  
Ying-Hu JI ◽  
Lian-Jun WANG

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