Computational investigation of intermetallic compounds (Cu6Sn5 and Cu3Sn) growth during solid-state aging process

2011 ◽  
Vol 50 (5) ◽  
pp. 1692-1700 ◽  
Author(s):  
M.S. Park ◽  
R. Arróyave
2020 ◽  
Vol 32 (5) ◽  
pp. 1896-1903
Author(s):  
Bin Ouyang ◽  
Yan Wang ◽  
Yingzhi Sun ◽  
Gerbrand Ceder

2021 ◽  
Vol 1016 ◽  
pp. 990-996
Author(s):  
Takeshi Nagase

Fast electron irradiation can induce the solid-state amorphization (SSA) of many intermetallic compounds. The occurrence of SSA stimulated by fast electron irradiation was found in the Al0.5TiZrPdCuNi high-entropy alloy (HEA). The relationship between the occurrence of SSA in intermetallic compounds under fast electron irradiation and the empirical alloy parameters for predicting the solid-solution-formation tendency in HEAs was discussed. The occurrence of SSA in intermetallic compounds was hardly predicted, only by the alloy parameters of δ or ΔHmix, which have been widely used for predicting solid-solution formation in HEAs. All intermetallic compounds with ΔHmix ≤ -35 kJ/mol and those with δ ≥ 12.5 exhibit the occurrence of SSA. This implies that the intermetallic compounds with a largely negative ΔHmix value and a largely positive δ parameter are favorable for the occurrence of SSA.


Crystals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 267
Author(s):  
Constantin Hoch

Recently, I witnessed a discussion amongst solid state chemists whether the term polar intermetallic bonding was necessary or dispensable, whether a conceptual discernation of this special class of intermetallic compounds was indicated or spurious [...]


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