Molecular dynamics study of strain rate effects on tensile behavior of single crystal titanium nanowire

2017 ◽  
Vol 128 ◽  
pp. 348-358 ◽  
Author(s):  
Le Chang ◽  
Chang-Yu Zhou ◽  
Lei-Lei Wen ◽  
Jian Li ◽  
Xiao-Hua He
2008 ◽  
Vol 33-37 ◽  
pp. 875-880
Author(s):  
Zhuo Zhuang ◽  
Zhan Li Liu ◽  
Xiao Chuan You ◽  
Y. Guo

With the development of material science, especially as MEMS/NEMS are playing a more and more important role in modern engineering, some mechanical behaviors of materials, e.g., fracture, shear instability, need to be investigated from multidisciplinary perspective. The molecular dynamics (MD) simulations are performed on single-crystal copper block under simple shear to investigate the size and strain rate effects on the mechanical responses of face-centered cubic (fcc) metals. It is shown that the yield stress decreases with the specimen size and increases with the strain rate. Based on the theory of dislocation nucleation, a modified power law is proposed to predict the scaling behavior of fcc metals. In the MD simulations with different strain rates, a critical strain rate exists for each single-crystal copper block of given size, below which the yield stress is nearly insensitive to the strain rate. A hyper-surface is therefore formulated to describe the combined size and strain rate effects on the plastic yield stress of fcc metals.


2011 ◽  
Vol 675-677 ◽  
pp. 671-673 ◽  
Author(s):  
Shuang Xu ◽  
Ya Fang Guo

Molecular dynamics (MD) simulations with an EAM potential are carried out to study the strain rate effects on the tensile deformation of single-crystal copper films. The stress, the atomic energy, as well as the atomic configurations of the systems are presented to explore the strain rate effects on copper films. It is found that yield stress increases with loading rate. Meanwhile, deformation mechanisms with different strain rates are analyzed in the present work. At lower strain rate, slips along {111} planes are primarily responsible for the plastic deformation in nano-Cu films. As strain rate increased, the motion of dislocations becomes easier, a transition of the deformation mechanism from sequential propagation of slips along well-defined slip planes to complex cross-slip.


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