Shear response of grain boundary bicrystals with a stacking fault tetrahedron

2018 ◽  
Vol 147 ◽  
pp. 137-144 ◽  
Author(s):  
Lianping Wu ◽  
Wenshan Yu ◽  
Shuling Hu ◽  
Shengping Shen
Keyword(s):  
Grain Boundary ◽  
Stacking Fault ◽  
Shear Response ◽  
Stacking Fault Tetrahedron

scholarly journals Dynamic interaction between grain boundary and stacking fault tetrahedron

2018 ◽  
Vol 144 ◽  
pp. 78-83 ◽  
Author(s):  
Liang Zhang ◽  
Cheng Lu ◽  
Kiet Tieu ◽  
Yasushi Shibuta
Keyword(s):  
Grain Boundary ◽  
Dynamic Interaction ◽  
Stacking Fault ◽  
Stacking Fault Tetrahedron

Measurement of the Displacement Across a Coincidence Grain Boundary

1977 ◽  
Vol 35 ◽  
pp. 124-125
Author(s):  
J. W. Matthews ◽  
W. M. Stobbs
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Stacking Fault ◽  
The Other ◽  
Measuring Technique ◽  
High Angle ◽  
Twin Boundaries ◽  
Rigid Displacement ◽  
Cubic Crystals ◽  
Lattice Displacement

Many high-angle grain boundaries in cubic crystals are thought to be either coincidence boundaries (1) or coincidence boundaries to which grain boundary dislocations have been added (1,2). Calculations of the arrangement of atoms inside coincidence boundaries suggest that the coincidence lattice will usually not be continuous across a coincidence boundary (3). There will usually be a rigid displacement of the lattice on one side of the boundary relative to that on the other. This displacement gives rise to a stacking fault in the coincidence lattice.Recently, Pond (4) and Smith (5) have measured the lattice displacement at coincidence boundaries in aluminum. We have developed (6) an alternative to the measuring technique used by them, and have used it to find two of the three components of the displacement at {112} lateral twin boundaries in gold. This paper describes our method and presents a brief account of the results we have obtained.

Interaction of Edge Dislocation With Stacking Fault Tetrahedron in Cu

2011 ◽  
Vol 134 (1) ◽  
Author(s):  
Jianfeng Jin ◽  
Hanchen Huang
Keyword(s):  
Yield Strength ◽  
Cross Section ◽  
Edge Dislocation ◽  
Driving Force ◽  
Stacking Fault ◽  
Morphological Transformation ◽  
Atomic Mechanism ◽  
Stacking Fault Tetrahedra ◽  
Stacking Fault Tetrahedron ◽  
Thermodynamic Driving Force

This paper reports an anomaly in the yield strength of dislocation interacting with stacking fault tetrahedra (SFT) in Cu, reveals atomic mechanisms that are responsible for the anomaly, and further shows the thermodynamic driving force for the atomic mechanisms to prevail. Instead of monotonically increasing with the area of intersection cross-section, the yield strength first increases and then decreases with the area. The decrease, or the anomaly, is due to a change of atomic mechanism of the interactions—the SFT goes through a morphological transformation. The thermodynamic driving force for the transformation derives from the competition between the elastic energy of dislocations and the stacking fault energy.

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