Effect of abrasive particle shape on the development of silicon substrate during nano-grinding

2021 ◽  
Vol 193 ◽  
pp. 110420
Author(s):  
Yuhua Huang ◽  
Miaocao Wang ◽  
Jinming Li ◽  
Fulong Zhu
1996 ◽  
Vol 39 (4) ◽  
pp. 803-810 ◽  
Author(s):  
Michael G. Hamblin ◽  
Gwidon W. Stachowiak

1985 ◽  
Vol 28 (2) ◽  
pp. 225-230 ◽  
Author(s):  
P. A. Swanson ◽  
A. F. Vetter

Author(s):  
AVISHKAR RATHOD ◽  
S G SAPATE ◽  
R. K. KHATIRKAR

The engineering components are subjected to surface damage by slurry abrasion such as transportation pipes carrying ore and mineral slurries, extruders, sand pumps and agitators, Apart from stress, abrasive particle hardness, slurry concentration, particle size and shape significantly influences slurry abrasion rate. The effect of abrasive particle shape on slurry abrasion behaviour of steels and cast irons which are widely used for wear protection has not been studied. The particle shape assumes significant importance due to fracture and fragmentation of the particles during the process of abrasion. In the present work, the particle shape characterization of silica sand abrasive particles was carried by shape factor analysis using image analysis technique. An attempt was made to correlate the different measures of shape factor with particle size of abrasive particles over a wide range. The characterization of slurry abrasion tester was carried out using slurry abrasion tester with silica sand slurry. The effect of sliding distance on slurry abrasion volume of mild steel was studied. The volume loss increased linearly with sliding distance. The scanning electron microscopic observations of worn our surfaces showed micro-ploughing and cutting as mechanism of material removal.


2014 ◽  
Vol E97.C (7) ◽  
pp. 677-682
Author(s):  
Sung YUN WOO ◽  
Young JUN YOON ◽  
Jae HWA SEO ◽  
Gwan MIN YOO ◽  
Seongjae CHO ◽  
...  

2014 ◽  
Vol 2 (1) ◽  
pp. 20-23
Author(s):  
Jaskiran Kaur ◽  
◽  
Surinder Singh ◽  

Author(s):  
J.G. van Hassel ◽  
Xiao-Mei Zhang

Abstract Failures induced in the silicon substrate by process marginalities or process mistakes need continuous attention in new as well as established technologies. Several case studies showing implant related defects and dislocations in silicon will be discussed. Depending on the electrical characteristics of the failure the localization method has to be chosen. The emphasis of the discussion will be on the importance of the right choice for further physical de-processing to reveal the defect. This paper focuses on the localization method, the de- processing technique and the use of Wright etch for subsequent TEM preparation.


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