Thermal analysis of partial crystallization during recovery from cryogenic storage using a semi-empirical approach

Cryobiology ◽  
2020 ◽  
Vol 97 ◽  
pp. 264-265
Author(s):  
Purva Joshi ◽  
Yoed Rabin
Keyword(s):  
Thermal Analysis ◽  
Empirical Approach ◽  
Cryogenic Storage ◽  
Partial Crystallization ◽  
Semi Empirical

Unsteady Analysis of a Mechanical Seal Using Duhamel’s Method

2004 ◽  
Author(s):  
Richard F. Salant ◽  
Bin Cao
Keyword(s):  
Thermal Analysis ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Numerical Model ◽  
Numerical Experiment ◽  
Auxiliary Function ◽  
Empirical Approach ◽  
Mechanical Seal ◽  
Element Analysis ◽  
Semi Empirical

An unsteady numerical model of a mechanical seal, with mixed lubrication, has been developed. The thermal analysis is performed using Duhamel’s method is combination with a numerical experiment to determine Duhamel’s auxiliary function. The results using this semi-empirical approach compare well with those from a finite element analysis. The model has been used to predict the performance of a mechanical seal during startup and shutdown.

scholarly journals Heat transfer simulation of the cure of thermoplastic particle interleaf carbon fibre epoxy prepregs

2018 ◽  
Vol 53 (15) ◽  
pp. 2053-2064 ◽  
Author(s):  
Tassos Mesogitis ◽  
James Kratz ◽  
Alex A Skordos
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Sensitivity Study ◽  
Process Models ◽  
Analysis Techniques ◽  
New Class ◽  
Thermosetting Polymers ◽  
Heat Transfer Simulation ◽  
Thermal Analysis Techniques ◽  
Semi Empirical

Thermochemical properties are needed to develop process models and define suitable cure cycles to convert thermosetting polymers into rigid glassy materials. Uncertainty surrounding the suitability of thermal analysis techniques and semi-empirical models developed for conventional composite materials has been raised for the new class of particle interleaf materials. This paper describes kinetics, conductivity, heat capacity and glass transition temperature measurements of HexPly® M21 particle interleaf material. Thermal models describing conventional, non-particle epoxy systems were fit to the data and validated through a thick-section cure. Results from curing experiments agree with heat transfer simulation predictions, indicating that established thermal analysis techniques and models can describe polymerisation and evolving material properties during processing of a material representing the class of interleaf toughened systems. A sensitivity study showed time savings up to about 20%, and associated energy-efficiency-productivity benefits can be achieved by using cure simulation for particle interleaf materials.

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